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Murata, QuantumScape Enter Into Joint Development Agreement for Manufacturing of Ceramic Separators
October 16, 2025 | MurataEstimated reading time: 1 minute
Murata Manufacturing Co., Ltd. and QuantumScape Corporation have entered into a joint development agreement aimed at high-volume production of ceramic separators* for QuantumScape’s solid-state batteries.
Since February 2025, the two companies have been exploring a potential collaboration toward the high-volume production of ceramic films. Through these discussions, it was confirmed that Murata’s technologies in ceramics material formulation, sheet forming, and firing could be applied to the high-volume production of QuantumScape’s ceramic separators. As a result, the two companies have now entered into the next phase of their collaboration, which includes scaling ceramic separator production and exploring a business model for commercialization.
Norio Nakajima, President of Murata Manufacturing Co., Ltd., stated: “We are pleased that our collaborative discussions with QuantumScape have advanced to a new stage with the signing of a joint development agreement. Moving forward, Murata will leverage its strengths in ceramics technology to contribute to the high volume production of QuantumScape’s solid state batteries.”
Dr. Siva Sivaram, CEO of QuantumScape, stated: “We are pleased to continue our collaboration with Murata, a world-class ceramics manufacturer, as we work together to advance the high-volume production of our ceramic separators. Partnership with Murata is an important part of building a robust global ecosystem of suppliers to support the commercialization of QuantumScape’s solid-state battery technology.”
*Ceramic separator: A fired product made from ceramic film.
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Below the Surface: From Substrate to System—Why Integration Is the Real RF Breakthrough
03/17/2026 | Chandra Gupta -- Column: Below the SurfaceIn my last column, I described the ceramic substrate itself, and why material choice matters so deeply in RF, microwave, and millimeter-wave applications. Dielectric constant, loss tangent, thermal conductivity, stability across temperature, and frequency are the physical rules that govern whether a signal arrives intact or collapses into noise.
Powering the Future: How Packaging Choices Make or Break Performance
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Semiconductor Ceramic Packaging Market to Reach $2.78B by 2030, Growing at 8.5% CAGR
03/04/2026 | Globe NewswireThe semiconductor ceramic packaging materials market size is projected to grow from USD 1.85 billion in 2025 to USD 2.78 billion by 2030, registering a CAGR of 8.5%.