The Chemical Connection: Onshoring PCB Production—Daunting but Certainly Possible
It’s Only Common Sense: The Phone Is Still Mightier Than the Keyboard
Indium Expert to Present on Advancing Thermal Performance at TestConX China
October 21, 2025 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation Assistant Product Manager Foo Siang Hooi will deliver a technical presentation at TestConX China, to be held November 13 in Shanghai. He will focus on advancing thermal performance in high-performance computing, automotive electronics, and power semiconductor applications with an innovative thermal interface material (TIM).
The presentation, Advancing Thermal Performance: Next-Generation Pattern X–Compressible Metal TIM for Warped and Non-Planar Surfaces, will focus on Next-Generation Pattern X, which is composed of pure indium and delivers excellent thermal transfer and low contact pressure (~30psi). The novel compressible metal TIM avoids common polymer-based TIM failures, such as pump-out and bake-out, and is reworkable to provide added flexibility and cost efficiency.
“As electronic systems continue to evolve toward higher power densities and more complex packaging, compressible metal TIMs like Next-Generation Pattern X are emerging as essential solutions,” said Foo. “With its unique ability to manage thermal challenges on warped or non-planar surfaces, Next-Generation Pattern X sets a new benchmark in reliable, high-performance thermal interface design.”
As Assistant Product Manager at Indium Corporation, Foo plays a pivotal role in driving the company’s business development and expansion of engineered solder products across the Asia region. His responsibilities include delivering technical and commercial training on application technologies and products, as well as ensuring a comprehensive understanding for clients and stakeholders.
Foo earned a bachelor’s degree with honors in electronics engineering from Multimedia University in Malaysia. He is also a Six Sigma Green Belt and ISO 9000 certified.
The presentation will take place on November 13 at 4 p.m.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Peters Spotlights ELPEPCB® HSP 801 S at productronica
10/22/2025 | PetersThe ELPEPCB® HSP 801 S heatsink paste is considered a premium product for Peters when exhibiting at the upcoming productronica. At the world’s leading trade fair for electronics development and manufacturing which will take place in Munich from November 18 to 21, 2025.
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Advanced Semiconductor Packaging Market Sees Rising Adoption Across Automotive and Industrial Sectors
10/14/2025 | openPRThe semiconductor packaging market size is estimated to reach at a CAGR of 7.2% during the forecast period (2024-2031).
Beyond Thermal Conductivity: Exploring Polymer-based TIM Strategies for High-power-density Electronics
10/13/2025 | Padmanabha Shakthivelu and Nico Bruijnis, MacDermid Alpha Electronics SolutionsAs power density and thermal loads continue to increase, effective thermal management becomes increasingly important. Rapid and efficient heat transfer from power semiconductor chip packages is essential for achieving optimal performance and ensuring long-term reliability of temperature-sensitive components. This is particularly crucial in power systems that support advanced applications such as green energy generation, electric vehicles, aerospace, and defense, along with high-speed computing for data centers and artificial intelligence (AI).
The Latest Issue: Advanced Electronics Packaging Digest to Explore Critical Minerals, Substrates, and Reliability Standards Driving Next-Gen Electronics
10/09/2025 | I-Connect007I-Connect007 is pleased to announce the upcoming issue of Advanced Electronics Packaging Digest (AEPD) on October 13, 2025, featuring expert insights on the technologies shaping the future of advanced packaging. As the electronics industry evolves, this issue takes a closer look at the materials, designs, and standards redefining performance and reliability across global markets.