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LPMS USA to Offer Live Molding Demos at IPC APEX 2025

02/07/2025 | LPMS USA
LPMS USA, a leader in low pressure molding solutions, is thrilled to exhibit at IPC APEX 2025. Join us at Booth #2300 for live molding demonstrations using the innovative KAPPA 1100H.

IPC Introduces First Standard for In-Mold Electronics

11/18/2024 | IPC
IPC announces the release of IPC-8401, Guidelines for In-Mold Electronics. IPC-8401 addresses in-mold electronics (IME) technology, providing industry consensus on guidelines for manufacturing processes, part structures, material selection, and production test methods to integrate printed electronics and components into 3D smart structures.

DELO Introduces UV-approach for Fan-out Wafer-level Packaging

10/25/2024 | DELO
DELO has developed a new approach for fan-out wafer-level packaging (FOWLP). Its feasibility study shows: With the use of UV-curable molding materials instead of heat curing ones, warpage and die shift can be reduced significantly. Additionally, this leads to improvements in curing time and minimizes the energy consumption.

In-mold Electronics: The Convergence of Innovative Materials and Manufacturing Techniques

08/07/2024 | Linda Stepanich, IPC
Paavo Niskala, a noted expert in in-mold electronics (IME) at TactoTek, recognized the need for an industry-wide standard when one of his automotive OEM clients asked him how to test a prototype TactoTek had developed. That question led to the creation of the first-ever IPC standard of this type, IPC-8401, Guidelines for In-Mold Electronics, to be released later this year.

Nano Dimension Sells Two High Precision 3D Fabrica 2.0 Systems to Accumold

12/28/2022 | Nano Dimension Ltd.
Nano Dimension Ltd., a leading supplier of Additively Manufactured Electronics (AME) and multi-dimensional polymer, metal & ceramic Additive Manufacturing (AM) 3D printers, announced today the sale of two Fabrica 2.0 Micro-AM systems to Accumold, an expert in micro molding from Iowa, USA.
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