Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "

Brent Fischthal - Koh Young

Suggested Items

XELA Robotics Announces Integration Milestone and Reveals its 2026 Technology Roadmap

12/04/2025 | PRNewswire
XELA Robotics, a specialist in advanced 3D tactile sensor technology, has successfully integrated its uSkin® sensors into a Tesollo DG-5F five-fingered anthropomorphic robot hand – a popular model capable of human-level gripping and manipulation.

Foxconn, Intrinsic Launch Joint Venture to Build AI Factory of the Future

12/03/2025 | Foxconn
Hon Hai Technology Group and Intrinsic are launching a joint venture that will in partnership make the intelligent factory of the future a reality.

Teens and Their Robots Steal the Spotlight at SMTAI

11/24/2025 | Brittany Martin, I-Connect007
The rows of gleaming booths at SMTAI 2025, each one humming with the latest in automation, stretched across the show floor. In the center of it all, a small crowd gathered for something far more kinetic. They were watching a 6-foot robot whir to life, lift a bright dodgeball, and launch it cleanly into a hoop across the aisle. The crowd erupted in cheers as the robot’s handlers—teenagers in blue shirts emblazoned with a roaring lion logo—rushed forward to reset the shot.

Pioneering Robot ‘OTTO’ Wins the 2025 IERA Award

11/19/2025 | IFR
The 2025 “Award for Innovation and Entrepreneurship in Robotics & Automation” (IERA) goes to OTTO by Rockwell Automation for its pioneering achievement in developing the company’s autonomous mobile robots (AMRs).

Sensetics Raises $1.75M to Take Touch Sensing and Haptics into the Digital Age

11/17/2025 | PRNewswire
Sensetics, a next generation haptics and touch data company advancing the digital capture and transmission of realistic touch experiences and bridging the machine and physical worlds by bringing touch to AI, announced it has raised $1.75mm in pre-seed funding to accelerate product development efforts for its breakthrough hardware and software platform.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in