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Smart Automation: When Traditional Depaneling Methods Reach Their Limits

06/16/2026 | Josh Casper -- Column: Smart Automation
PCB depaneling has traditionally been viewed as a relatively straightforward process in electronics manufacturing. Once the assembly process is complete, boards are separated from the panel and moved downstream for final assembly, test, or packaging. For years, manufacturers have relied on methods such as routing, V-score separation, and punch systems to handle this step efficiently and cost-effectively.

Rethinking Stackup, Materials, and Tolerances in Modern Designs

05/18/2026 | Kristin Moyer, Global Electronics Association
The simple rectangular rigid PCB is becoming increasingly infrequent. This reality necessitates designing with concepts well outside traditional rigid PCB methodologies. For example, the designer of wearable electronics may need to implement conductive fibers integrated into the textile material. Heads-up displays, like those in VR/AR headsets and glasses, require transparent circuitry etched into the display glass. The process of designing without a rule book usually starts with something other than the traditional board design process.

Protecting Advanced Trucking Electronics in Harsh Environments

05/13/2026 | Beth Massey, MacDermid Alpha Electronics Solutions
For decades, trucking was defined by horsepower, payload, and driver endurance. Today, the competitive edge lies in electronics, as advanced sensing, communications, and data processing systems reshape how commercial vehicles operate. The industry is rapidly digitizing, with electronic systems now critical to safety, uptime, and fleet efficiency. Technologies like ADAS, radar, lidar, and telematics enable real-time decision-making, while distributed sensors monitor key vehicle functions. Because these systems operate in harsh conditions, environmental protection using potting, coatings, and encapsulation is now a core design priority.

PTC Onshape Introduces Direct Altium Integration to Streamline ECAD-MCAD Collaboration

05/12/2026 | PRNewswire
PTC announced a new integration between its cloud-native Onshape® computer‑aided design (CAD) and product data management (PDM) platform and Altium.

Powering the Future: How Packaging Choices Make or Break Performance

03/11/2026 | Brian Buyea -- Column: Powering the Future
When we talk about reliability in electronics, we often focus on the system level: redundancy, fail-safes, or software resilience. But long before the system is assembled or even tested, reliability is considered in materials, metallization, and the packaging process itself. If the foundation isn’t built to survive the environment, no amount of clever design downstream will make up for it.
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