November 2025 Design007 Magazine: Proper Plane Design
November 10, 2025 | I-Connect007 Editorial TeamEstimated reading time: 1 minute
In this November issue of Design007 Magazine, we’re focusing on power and ground planes, the ones that help your signals get to their final destination in today’s PCBs.
Planes aren’t magic, but they are big time-savers. Without planes, designers would have to create thousands of traces to accomplish the same objectives. While designers might be tempted just to use a sheet of copper, planes are more than simple copper pours. They provide a decisive advantage in that they have extremely low impedance: Since it’s a sheet of copper, the impedance is almost non-existent.
As a result, power planes provide low impedance and stable power to every component on the board, much like a large power bus. Next to a signal layer, a power plane can shield signals and stop crosstalk and noise. They make great heat sinks too.
Ground planes stabilize reference voltage, improve thermal performance, and help preclude EMI issues. They offer a low-impedance return path, which helps eliminate jitter and reflections.
Power and ground plane design is often a battle of tradeoffs. Selecting the correct copper thickness of power planes is a good example: Thin copper with high currents can cause IR drop, which can lead to timing errors. This can be mitigated by using thicker copper, but this also affects your signal integrity planning, not to mention your fabricator’s workload.
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Brent Fischthal - Koh YoungSuggested Items
The Shaughnessy Report: Zee Plane! Zee Plane!
11/11/2025 | Andy Shaughnessy -- Column: The Shaughnessy ReportPlanes aren’t magic, but they are big time-savers. Without planes, designers would have to create thousands of traces to accomplish the same objectives. You can imagine the first time a designer thought about using a sheet of copper, asking, “Hey, why am I killing myself laying out all these traces? Can’t I just use this sheet of copper instead?”
Designers Notebook: Power and Ground Distribution Basics
10/29/2025 | Vern Solberg -- Column: Designer's NotebookThe principal objectives to be established during the planning stage are to define the interrelationship between all component elements and confirm that there is sufficient surface area for placement, the space needed to ensure efficient circuit interconnect, and to accommodate adequate power and ground distribution.
Beyond Design: The Fundamental Structure of Spectral Integrity
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Beyond Design: Slaying Signal Integrity Villains
09/17/2025 | Barry Olney -- Column: Beyond DesignHigh-speed PCB design is a balancing act, where subtle oversights can develop into major signal integrity nightmares. Some culprits lie dormant during early validation, only to reveal themselves later through workflow disruptions and elusive performance bottlenecks. Take crosstalk, for example. What begins as a stray signal coupling between traces can ripple through the design, ultimately destabilizing the power distribution network. Each of these troublemakers operates with signature tactics, but they also have well-known vulnerabilities.
Amphenol Printed Circuits Brings Its Boards to the 2025 IMSI
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