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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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SIA Commends CHIPS Awards to Accelerate Advanced Compute Semiconductor R&D

07/30/2026 | SIA
The Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer applauding seven R&D awards announced by the CHIPS Research and Development Office (CRDO) to accelerate semiconductor R&D for the advanced compute supply chain.

Qnity Strengthens Long-Term Innovation and Advanced Packaging Roadmap

07/29/2026 | BUSINESS WIRE
Qnity Electronics, Inc., a premier technology solutions leader across the semiconductor value chain, announced it is accelerating investments in next-generation technologies through access to a broad portfolio of research programs.

Marvell Invests $250M in India to Expand AI Development

07/29/2026 | BUSINESS WIRE
Marvell Technology, Inc., a leader in data infrastructure semiconductor solutions, announced plans to invest $250 million in India over the next three years to expand its capabilities across technology, talent and infrastructure.

Intel, Lens Technology Collaborate to Enable Advanced Semiconductor Packaging for the AI Era

07/27/2026 | Intel
Intel Corporation and Lens Technology announced a strategic collaboration focused on enabling new technologies for advanced semiconductor packaging.

Vertical Aerospace Makes History With First Public eVTOL Transition Flight at Farnborough International Airshow

07/20/2026 | Vertical Aerospace
Vertical Aerospace, a global aerospace and technology company pioneering electric aviation, today made history by completing the first public electric vertical take-off and landing (eVTOL) flight at Farnborough International Airshow, switching from helicopter mode to airplane mode and back again.
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