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Advanced Electronics Packaging Digest: Third Issue Arrives November 17
November 12, 2025 | I-Connect007Estimated reading time: Less than a minute
The third issue of Advanced Electronics Packaging Digest launches Monday, November 17. This issue continues AEPD’s mission to deliver forward-looking analysis and insider perspectives on the technologies reshaping advanced electronics packaging.
Among the highlights is a review of IMPACT 2025, where discussions on component-to-system-level integration took center stage as experts explored the challenges and breakthroughs driving advanced packaging technologies. The event highlighted how collaboration among research institutions, manufacturers, and supply chains is accelerating innovation and bridging the gaps between design and production.
Marcy LaRont explores the UHDI revolution—the point where PCB manufacturing meets substrates and interposers to form the foundation of next-generation systems. She discusses how UHDI is redefining density, precision, and performance, setting new benchmarks for the entire electronics ecosystem.
Finally, Elephantech showcases how additive manufacturing is igniting a sustainability revolution in electronics. Through breakthroughs in printed circuitry, Elephantech demonstrates that greener, more efficient production can seamlessly align with cutting-edge design and performance.
From sustainability to system-level integration, this issue captures the pulse of an industry in transformation.
Don’t miss the conversations shaping the future of microelectronics!
Not yet subscribed? Subscribe now to stay informed and ahead of the curve.
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Mexico's Moment in Electronics Manufacturing
11/12/2025 | Lorena Villanueva, Global Electronics Association MexicoOn a weekday morning in the Bajío, Mexico, a training lab reviews accept/reject criteria before a line changeover. By mid-afternoon, a cross-border shipment clears in El Paso that left Ciudad Juárez at dawn. Farther south, a university team finalizes intake for a new electronics pathway blending online modules with factory practicums. These scenes—routine yet transformative—explain whyMexico is becoming the most strategic partner for the United States to ensure a resilient, innovative, and sovereign electronics supply chain in North America.
MacDermid Alpha Electronics Solutions to Feature an Integrated Materials Platform Engineered for Long-Term Reliability at Productronica
11/12/2025 | MacDermid Alpha Electronics SolutionsEvery advancement in electronics raises expectations for enhanced performance and environmental stewardship. Meeting these challenges demands materials engineered for reliability and developed to support sustainable manufacturing. Industry momentum across connected devices, high-reliability automotive electronics, and rapidly increasing compute density is elevating the role of materials selection as a core driver of long-term system performance.
Questex Refocuses Fierce Electronics Brand to Fierce Sensors
11/12/2025 | Globe NewswireQuestex announces the rebranding of Fierce Electronics to Fierce Sensors, leveraging its content mission to become the definitive platform for sensors-focused news, insights, and community engagement.
San Francisco Startup Tuurny Builds AI Robot to 'Mine' Electronic Waste for Critical Chips
11/12/2025 | Globe NewswireA San Francisco startup Tuurny announced it is developing a platform that solves world’s two massive, contradictory problems: a critical shortage of computer chips and a growing mountain of electronic waste.
Sypris Reports Third Quarter Results
11/12/2025 | BUSINESS WIREThe Company’s third quarter revenue decreased compared to the prior-year quarter primarily due to the near-term impact of tariffs, which reduced demand from certain transportation-related customers and necessitated the conversion of certain shipments from our facility in Mexico to a value-add only sub-maquiladora.