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SAICEC, Siemens to Accelerate Chip-to-Vehicle Validation Using Digital Twin Technology
November 17, 2025 | SiemensEstimated reading time: 1 minute
Siemens announced that SAICEC, a leading provider of chip and system design services for the automotive industry, has begun building complex digital twins of automotive architectures based on Siemens’ PAVE360™ software, facilitating comprehensive verification of automotive components from system-level to chip-level.
This initiative will accelerate the adoption of advanced solutions that help overcome the challenges of software-defined vehicle (SDV) development. It also supports OEMs in identifying next-generation chip technologies and developing critical systems at the scale and speed demanded by the mobility industry.
“Our collaboration with Siemens brings together world-class simulation technology and China’s fast-growing automotive integrated circuit (IC) ecosystem,” said David He, chief executive officer, SAICEC. “With Siemens’ PAVE360 system-to-chip digital twin capabilities, we can shorten development cycles, improve functional safety and strengthen the foundation for intelligent mobility design."
“Our work with SAICEC demonstrates how automotive OEMs are able to solve critical bottlenecks in ADAS and IVI capabilities development and deliver the innovation that consumers across the globe are demanding,” said Mike Ellow, CEO, Siemens EDA, Siemens Digital Industries Software. “PAVE360 is uniquely placed to provide the digital twin to support SAICEC’s new validation certification. With scalability at its core, the same multi-fidelity environment can be adapted over time to provide validation throughout the entire vehicle development flow.”
SDV programs grow in complexity as consumer expectations for integrated technology also continue to increase. Today’s automotive hardware and software teams often operate in silos across disparate environments, with limited access to a system-level view until final hardware is available. This lack of early-stage validation leads to costly redesigns when final hardware fails certification tests. System-level verification before hardware availability is now essential for future success.
PAVE360 leverages Siemens’ Innexis™ software environment combined with supporting technologies to empower users to create system-level digital twins of ADAS and IVI capabilities. These digital twins can be connected to reference vehicles to perform functional validation from the earliest design stages. OEMs and suppliers alike can leverage PAVE360 to accelerate validation and foster innovation within a proven, real-world digital environment.
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11/07/2025 | SiemensAt the NVIDIA GTC (GPU Technology Conference) in Washington, D.C., Siemens and NVIDIA demonstrated a new technology stack currently in development for the Siemens Xcelerator portfolio.
Siemens, NEC Collaborate to Accelerate Smart Factory Innovation
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Siemens, ASE Collaborate on Workflows for ASE’s VIPack Advanced Packaging Platform
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Siemens Collaborates with TSMC to Accelerate 3D IC and AI-driven Circuit and Systems Design
09/24/2025 | SiemensAt the 2025 TSMC North America Open Innovation Platform® (OIP) Ecosystem Forum, Siemens Digital Industries Software announced multiple new collaborations with TSMC, including product certifications and innovative design solutions enablement initiatives for the foundry’s newest and most advanced process technologies.
Siemens Launches Lighthouse Project of Made for Germany Initiative
09/23/2025 | SiemensIn the presence of political leaders and representatives of the business community, Siemens today laid the cornerstone for the new Siemens Technology Campus in Erlangen, Germany. A lighthouse project of the Made for Germany initiative, the Technology Campus will further strengthen the economic viability of Germany and the region primarily in the area of power electronics.