Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"

Rachael Temple - Alltemated

Suggested Items

Applications, Challenges, and the Future of Flex–Packaging Integration, Part 2

04/16/2026 | Anaya Vardya, American Standard Circuits
In the second of this two-part series, Anaya Vardya of American Standard Circuits examines applications, challenges, manufacturing considerations, and future trends emerging from the convergence of flexible printed circuit boards and advanced semiconductor packaging. Applications driving the convergence include consumer electronics, automotive systems, medical, wearables, aerospace and more.

Huawei, LG Electronics and Nokia Named as Founder Licensors of New Sisvel POS Pool

04/01/2026 | BUSINESS WIRE
Three world-class innovators are the founder licensors of the new Point of Sale (POS) patent pool, covering 2G to 5G technology, which Sisvel has launched today.

Asia/Pacific PC Market Up 11.6% in 2025; Supply and Pricing Challenges Loom for 2026

03/24/2026 | IDC
The Asia/Pacific (including Japan and China)  traditional PC market (desktops, notebooks, and workstations) grew by 11.6% in 2025 to 106.6 million units, according to the International Data Corporation (IDC) Worldwide Quarterly Personal Computing Devices Tracker, Q4 2025.

Thick Film Materials Market 2026: Driving Electronics Innovation

03/19/2026 | EINPresswire.com
Thick Film Materials market to surpass $26 billion in 2030. In comparison, the Integrated Circuits market, which is considered as its parent market, is expected to be approximately $658 billion by 2030, with Thick Film Materials to represent around 4% of the parent market.

Texas Instruments Expands Microcontroller Portfolio to Enable Edge AI in Every Device

03/13/2026 | Texas Instruments
Texas Instruments (TI) introduced two new microcontroller (MCU) families with edge artificial intelligence (AI) capabilities, supporting the company's commitment to enabling edge AI across its entire embedded processing portfolio. The MSPM0G5187 and AM13Ex MCUs integrate
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in