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Why Reliability Matters More Than Ever—Ultra HDI Podcast Episode 9 Now Streaming
November 21, 2025 | I-Connect007Estimated reading time: Less than a minute
What does it take to design for ultimate reliability? Find out in Episode 9 of I-Connect007’s acclaimed podcast series, On the Line With… American Standard Circuits: Ultra HDI.
In “High-Reliability Applications,” host Nolan Johnson and John Johnson of American Standard Circuits discuss how UHDI technology is enabling engineers to deliver stronger, more sustainable solutions in high-stakes industries.
Listen now on all major podcast platforms, including Apple Podcasts and Spotify, and download free takeaways from each episode to keep your UHDI knowledge both current and practical.
About the On the Line With… Ultra HDI Series
This 12-part podcast series from I-Connect007 explores the processes, materials, and design considerations driving ultra-high-density interconnect (UHDI) technology. Each episode features insights from industry experts who share best practices, innovations, and strategies shaping the future of advanced electronics manufacturing.
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"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
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11/17/2025 | Marcy LaRont, I-Connect007For decades, the PCB and the semiconductor package lived in separate universes. PCBs belonged to the world of board shops, panels, and assembly lines; packages belonged to semiconductor fabs and OSATs. Substrates and interposers, meanwhile, were niche system-level package “components” in the middle, largely invisible to the outside world. That separation is dissolving as definitions broaden. The rise of high-density interconnect (HDI) and its next-generation cousin, ultra HDI (UHDI), is pushing PCB manufacturing into territory once reserved for semiconductor packaging.
UHDI Fundamentals: An Overview of UHDI Substrate Materials and Vias
11/13/2025 | Anaya Vardya, American Standard CircuitsThe rapid proliferation of 5G/6G communications, Internet of Things (IoT), high-performance computing (HPC), AI, and medical electronics has driven the need for increasingly compact, high-performance circuit packaging. UHDI, defined by feature sizes well below traditional HDI, addresses these demands by enabling ultra-fine lines, dense via interconnects, and embedded passive functionality. Understanding the materials and layering strategies in UHDI is essential for advancing both manufacturing and application design
Advanced Electronics Packaging Digest: Third Issue Arrives November 17
11/12/2025 | I-Connect007The third issue of Advanced Electronics Packaging Digest launches Monday, November 17. This issue continues AEPD’s mission to deliver forward-looking analysis and insider perspectives on the technologies reshaping advanced electronics packaging. Among the highlights is a review of IMPACT 2025, where discussions on component-to-system-level integration took center stage as experts explored the challenges and breakthroughs driving advanced packaging technologies.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
11/07/2025 | Marcy LaRont, I-Connect007In electronics industry news, my picks start with Pete Starkey’s review of EIPC’s latest Technology Snapshot webinar. With all eyes on Europe as a pressure lever for ESG worldwide, Pete’s coverage is a must-read. Next, I want you to check out the new column by Leo Lambert on EPTAC, who provides a solid and complete overview of UHDI from concept to assembly.
Learning With Leo: UHDI—The Next Leap in PCB Manufacturing
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