Dr. Lisa Su, AMD Chair and CEO, Elected Chair of Semiconductor Industry Association
November 21, 2025 | SIAEstimated reading time: 2 minutes
The Semiconductor Industry Association (SIA) announced AMD Chair and CEO Dr. Lisa Su has been elected Chair of the SIA Board of Directors. SIA represents 99% of the U.S. semiconductor industry by revenue and nearly two-thirds of non-U.S. chip firms.
“We are delighted to welcome Dr. Lisa Su as SIA Chair during an exciting and consequential time for the semiconductor industry,” said SIA President and CEO John Neuffer. “Lisa has pushed the boundaries of semiconductor innovation for decades and is an extremely strong and influential leader in our industry. We look forward to her leadership in the year ahead as we push for policies that promote growth and innovation in the chip sector and keep America on top in this foundational, transformative technology.”
Dr. Su brings more than 30 years of experience in the semiconductor industry. As Chair and CEO of AMD, she has led the company’s transformation into a global leader in high performance computing and a key supplier of advanced AI chips. Before assuming her current role, Dr. Su served as chief operating officer at AMD, where she unified AMD’s business units, sales, operations, and infrastructure into a single organization focused on execution and market impact. Prior to her roles at AMD, Dr. Su held leadership roles with Freescale Semiconductor (now NXP Semiconductors), IBM, and Texas Instruments. Dr. Su holds a PhD in electrical engineering from the Massachusetts Institute of Technology, and in 2020 received the Robert N. Noyce Award for her groundbreaking contributions to the semiconductor industry.
“The semiconductor industry is at the heart of American innovation and essential to our economic growth and national security,” said Dr. Su. “It’s an honor to serve as Chair of SIA at such an important time. I look forward to working alongside my colleagues on the SIA Board of Directors to strengthen U.S. semiconductor competitiveness, extend our foundation for innovation, and build a stronger chip industry for many years to come.”
Subscribe
Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.
Subscribe now to stay informed, competitive, and connected.
Suggested Items
ASE, WUS Announce Strategic Collaboration to Build Advanced AI Packaging Hub in Kaohsiung
05/08/2026 | ASE GroupAdvanced Semiconductor Engineering, Inc. (ASE) and WUS Printed Circuit Co., Ltd. (WUS) announced today a strategic collaboration for the construction of a state-of-the-art manufacturing facility in the Nanzih Technology Industrial Park, Kaohsiung.
GlobalFoundries Outlines Long-Term Growth Roadmap and Announces First-Ever Dividend
05/08/2026 | GlobalFoundriesAt its 2026 Investor Day, GlobalFoundries highlighted clear opportunities for durable growth in AI-centric markets, expanding profitability and long-term value creation, underpinned by its broadening technology roadmap for the scaling of AI data centers and the proliferation of AI into the physical world, served from its unique, resilient global manufacturing footprint.
SEMI 3D & Systems Summit to Advance AI, Hybrid Bonding, and Chiplet Ecosystem
05/06/2026 | SEMIGlobal experts in advanced semiconductor packaging and 3D integration will convene at the annual SEMI 3D & Systems Summit, June 17–19, 2026, in Dresden, Germany.
Sharp Increase in Global Semiconductor Sales in Q1 2026
05/05/2026 | ESIAThe European Semiconductor Industry Association (ESIA) reports that, in the first quarter of 2026, the global semiconductor market recorded a sharp increase of 79.2% year-on-year, reaching USD 298.55 billion in sales.
Xanadu, EV Group Partner to Build Industrial-Scale Photonic Quantum Hardware
05/05/2026 | PRNewswireXanadu Quantum Technologies Ltd., a leading photonic quantum computing company, and EV Group (EVG), a leading supplier of wafer bonding and lithography equipment, announced a strategic partnership to develop critical heterogeneous integration and wafer bonding processes to facilitate the scalability of photonic quantum systems.