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New Research Group: AT&S Strengthens Microelectronics at TU Graz

02/11/2026 | AT&S
AT&S is setting another strategic milestone for the technological future of Europe and is funding the establishment of a new research group at Graz University of Technology (TU Graz) in the field of microelectronics with a focus on IC substrates and advanced packaging technologies.

NIAR Develops 'Chip-level Advanced Packaging Development Platform'

02/04/2026 | NIAR
As the global semiconductor industry enters the post-Moore’s Law era and the demand for Artificial Intelligence (AI) and High-Performance Computing (HPC) surges, advanced packaging has become a core technology determining technological competitiveness and industrial layout.

Analog Devices Appoints Yoky Matsuoka to its Board of Directors

01/27/2026 | Analog Devices, Inc.
Analog Devices, Inc. announced the appointment of Dr. Yoky Matsuoka to its Board of Directors as an independent director and member of the Board’s Corporate Development Committee effective January 20, 2026. Dr. Matsuoka’s appointment expands the Board to 11 members.

Hanshow, Cambridge Partner on Hybrid Wireless AI Research

12/26/2025 | BUSINESS WIRE
Hanshow, a global leader in electronic shelf labels (ESL) and digital store solutions, has entered into a multi-year research collaboration with the University of Cambridge, one of the world’s most prestigious academic institutions.

Keysight, Singapore Institutions Collaborate on Quantum Computing

12/19/2025 | BUSINESS WIRE
Keysight Technologies, Inc. announced the signing of a five-year Master Research Collaboration Agreement (MRCA) with Singapore’s leading quantum research institutions.
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