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Elephantech to Showcase Thick-Copper FPC and Ultra-Fine Copper Nanofiller at AABC 2025
November 26, 2025 | ElephantechEstimated reading time: 1 minute
Elephantech will be exhibiting at AABC 2025, held from December 9-11, in Las Vegas, USA.
At this leading international platform, we are set to meet innovators and manufacturers from around the world to discuss the latest technological developments and market needs in the automotive battery field.
Visit us at the JETRO Chicago Booth (No. 521), where Elephantech will showcase our advanced thick-copper Flexible Printed Circuit (FPC) as a key component of next-generation Battery Management System (BMS). Our FPC solution enables WiFi functionality to replace conventional wiring, delivering cost, manufacturing efficiency and environmental advantages simultaneously.
We will also present our 15-nm class ultra fine copper nanofiller, a high-performance material with strong potential for future battery applications. Come see our innovations up close!
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