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Marcy’s Musings: Looking Forward—APEX EXPO 2026 (and AI Design Tools Too)

02/18/2026 | Marcy LaRont -- Column: Marcy's Musings
This month, I-Connect007 Magazine takes you inside the show, from exhibitors and special events on the show floor to new insights from the technical conference, details on apprenticeships, keynotes, and advancements in critical industry standards. The show also has an international flavor, so we’ve included links to articles from Mexico, East Asia, and India about how they will be represented at APEX EXPO. It is a busy show that has a lot to offer attendees, and this issue will help ensure your time and attention are well spent.

ASC Sunstone Expands Online Quoting to Streamline Flex PCB Procurement

02/17/2026 | ASC Sunstone Circuits
As demand for compact, lightweight, and high-reliability electronic designs continues to grow, ASC Sunstone is making it easier for engineers to source flex circuitry with Instant Online Quoting for select Flex PCB configurations through its OneQuote® platform at sunstone.com.

Schweizer Electronic’s CTO Thomas Gottwald Steps Down

02/17/2026 | Schweizer Electronic AG
Thomas Gottwald (Chief Technology Officer) has decided to leave Schweizer Electronic AG prematurely for personal reasons.

I-Connect007 Magazine: APEX EXPO 2026 Preview Plus AI Tools Designers Are Watching

02/17/2026 | I-Connect007 Editorial Team
This month, I-Connect007 Magazine takes you inside APEX EXPO 2026, highlighting exhibitors and special events on the show floor, insights from the technical conference, updates on apprenticeships and keynotes, and progress in critical standards development. For PCB designers, we go beyond the dreaded auto-router, diving into practical AI-driven design tools that are actually shaping real-world workflows.

UHDI Fundamentals—Foundations and Drivers of the PCB Flex: Advanced Packaging Nexus, Part 1

02/16/2026 | Anaya Vardya, American Standard Circuits
The electronics industry is undergoing a fundamental transformation driven by demands for smaller form factors, higher performance, and greater functional integration. Two technologies sit at the center of this transformation: flexible PCBs and advanced semiconductor packaging. In this article, I’ll explore the technical foundations and key forces driving this convergence. Flexible PCBs are electrical interconnects fabricated on bendable substrates such as polyimide or polyester. Unlike rigid PCBs, flex circuits can conform to three-dimensional shapes, enabling designers to route signals through space rather than across flat planes
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