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From Silos to Systems: 2026 and Beyond
Welcome to the debut issue of I-Connect007 Magazine. This publication brings all of the pieces together from PCB design and fabrication for a closer alignment and a more integrated electronics manufacturing landscape.
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Zhen Ding Holding and Topoint Technology Sign Strategic Cooperation Agreement
December 2, 2025 | Zhen Ding TechnologyEstimated reading time: 2 minutes
Zhen Ding Tech. Group, the world’s largest PCB manufacturer, and Topoint Technology Co., Ltd., a global leader in precision drill bits and integrated drilling solutions, officially signed a strategic cooperation agreement at the Zen Ding Times Building in Shenzhen. The ceremony was jointly attended by Mr. Charles Shen, Chairman of Zen Ding, and Mr. Lin Hsu-Ting, Chairman of Topoint Technology, along with senior executives from both companies who witnessed this important milestone.
Under this agreement, the two parties will establish a comprehensive strategic partnership focused on advanced PCB drilling technologies, micro drill bit development, AI server applications, and next-generation substrate technologies. The collaboration aims to accelerate innovation, strengthen production capabilities, and expand market presence in high-end electronics applications.
Topoint Technology has long specialized in precision PCB drill bits and drilling process solutions, with strong R&D and manufacturing capabilities. The company has deep technical expertise in AI servers, ABF substrates, high-speed networking, HDI boards, and other advanced PCB applications. Through this partnership, Topoint will collaborate closely with Zen Ding to jointly develop high- efficiency, high-reliability advanced drilling processes, driving deeper cooperation in the high-end electronics industry.
As a global leader in the PCB industry, Zen Ding continues to invest heavily in advanced substrates and AI-related applications. By combining Zen Ding’s expertise in PCB design and manufacturing with Topoint’s strengths in precision drilling and tooling technologies, the partnership will further optimize supply chain synergy, enhance manufacturing competitiveness, and accelerate the development of smart production and sustainability initiatives.
Charles Shen, Chairman of Zen Ding said: “Topoint Technology possesses world-class innovation and technical capability in precision and high-performance drill bit development. We place great value on this partnership and look forward to deep collaborations in AI servers, advanced substrates, and high-speed communication applications, jointly driving industrial upgrades and technological breakthroughs.”
Lin Hsu-Ting, Chairman of Topoint Technology said: “Zen Ding is a global leader in the PCB industry and has played a crucial role in driving technological and manufacturing innovation. Topoint is honored to become a strategic partner of Zen Ding. Moving forward, we will combine our strengths in products, processes, and equipment to jointly develop high-efficiency, high-quality precision drilling solutions, injecting new momentum into the sustainable development of the electronics industry.”
Looking ahead, Zen Ding and Topoint will continue to deepen cooperation across new product development, supply chain integration strategies, AI-driven smart manufacturing, and sustainability, jointly advancing the PCB industry toward higher precision, higher efficiency, and greater value creation.
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Rachael Temple - AlltematedSuggested Items
NCAB Group Reports Strong Q4 and Year-End 2025 Results with Robust Sales and Order Growth
02/13/2026 | NCABNCAB Group released its Q4 and full-year 2025 results, reporting strong year-end momentum with double-digit growth in net sales and order intake, and a solid book-to-bill ratio of 1.21.
ICAPE: Consolidated Annual Revenue 2025
02/13/2026 | BUSINESS WIREAnnual revenue growth of +11.5% for ICAPE in 2025 to €202.7 million and organic growth excluding currency effects of +5.1%
EIPC Winter Conference Review: From Innovation to Qualification
02/13/2026 | Pete Starkey, I-Connect007Refreshed after a reasonably early night and a restful sleep, delegates dutifully re-assembled for Day 2 and Session 4 of EIPC’s Winter Conference in Aix-en-Provence on Feb. 4, “Driving the Future: Innovation, Energy, and Sustainability in PCB Technology.” The theme of this session, moderated by EIPC board member Martyn Gaudion, CEO of Polar Instruments, was “From innovation to qualification: New materials, processes and applications.” His first speaker was Steve Driver, whose presentation was entitled “Ideation > Certification > Qualification > Integration” and subtitled “The journey of a disruptor.”
High-Tech Hill in Lithuania: Europe’s PCB Comeback
02/12/2026 | Marcy LaRont, I-Connect007 MagazineTLT Manufacturing, part of the Teltonika group, is assembling something Europe hasn’t seen in decades: a fully integrated electronics manufacturing hub in Vilnius, Lithuania. Last September, TLT officially opened High-Tech Hill, its new technology campus, simultaneously launching four facilities: two EMS plants, a large greenfield PCB fabrication plant, and a plastic injection molding operation. This move brings design, tooling, production, and full manufacturing services under one roof.
PCB Design in 2026 and Beyond
02/12/2026 | Filbert Arzola, RaytheonWe asked several experts in PCB design and fabrication about the pressures shaping PCB fabrication today, including speed, density, geopolitics, and relentless technological complexity. The results were valuable insights about where we are, where we’re headed, and importantly, what it will take to get there. Here is Filbert (Fil) Arzola's view of what will be most important and influential for PCB designers going into 2026 and beyond.