Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."

Klaus Koziol - atg

Suggested Items

SK Telecom, NVIDIA Build AI Infrastructure to Power Korea’s AI Innovation

06/11/2026 | NVIDIA Newsroom
NVIDIA and SK Telecom announced that SK Telecom plans to build a gigawatt-scale AI Cloud in Korea using the NVIDIA DSX™ platform, with the first AI factory coming online in 2027.

Cadence Unveils Industry’s First Fully Autonomous Virtual Engineer for Chip Design, powered by NVIDIA

06/01/2026 | Cadence Design Systems
At Computex 2026, Cadence announced the industry’s first fully autonomous virtual agentic AI design engineer, extending the ChipStack™ AI Super Agent to Level-5 autonomy.

Agentic AI Fuels Memory Demand Growth, Market Projected to Hit $1.28T by 2027

05/29/2026 | TrendForce
The shift in AI development from large-scale model training toward inference-centric Agentic AI applications is driving a structural expansion in memory demand, according to TrendForce's latest findings on the memory industry.

Compal, GMI Cloud Announce Collaboration on AI Infrastructure Development

05/28/2026 | PRNewswire
Compal Electronics Inc. announced its collaboration with GMI Cloud, a Silicon Valley-based AI infrastructure provider, to advance the deployment of next-generation AI infrastructure optimized for large-scale inference and emerging agentic AI workloads.

Siemens Hardware-assisted Verification Validates Arm AGI CPU for Scalable Agentic AI

05/06/2026 | Siemens
Siemens has collaborated with Arm to support verification of the Arm® AGI CPU and validate its performance for next-generation agentic AI workloads, enabling scalable, production-ready infrastructure.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in