NCAB Releases PCB Supply Chain Outlook 2026
December 8, 2025 | NCABEstimated reading time: Less than a minute
The PCB market is currently undergoing a drastic shift. After a period of relative stability, we see that manufacturing capacity is tightening during next year, lead times are extending, and input costs are rising sharply. This is primarily driven by the explosive growth of Artificial Intelligence (AI) and data center infrastructure, and a volatile commodities market.
The price of gold has driven manufacturing costs for ENIG (Electroless Nickel Immersion Gold) products up by as much as 37%. Even boards containing no gold are being significantly impacted due to copper and laminate increases having impacts of up to 10% increases.
While strategic procurement measures may have managed to delay the immediate impact of these rising input costs throughout 2025, the continued increases of raw material indexes make price adjustments unavoidable as we move into January 2026.
In our PCB Supply Chain Outlook 2026, we outline the macroeconomic drivers behind these changes and provide actionable strategies for procurement leaders to secure supply and manage costs in what is becoming a seller’s market.
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
Uyemura Opens Dedicated UBM and Prototype Plating Line at Southington Tech Center
11/25/2025 | UyemuraUyemura has commissioned a dedicated plating tool at its Southington, CT Tech Center that addresses 3 urgent needs.
Würth Elektronik ICS Germany Honored by EcoVadis
11/04/2025 | Wurth ElektronikWürth Elektronik ICS has undergone its most recent evaluation by EcoVadis and has been awarded the Gold Medal for its sustainability performance. After receiving a Silver rating last year, the provider of electromechanical and electronic solutions for signal and power distribution in commercial vehicles and mobile machinery improved its score by twelve points, reaching 81 out of 100.
Day 1: Cutting Edge Insights at the EIPC Summer Conference
06/17/2025 | Pete Starkey, I-Connect007The European Institute for the PCB Community (EIPC) Summer Conference took place this year in Edinburgh, Scotland, June 3-4. This is the second of three articles on the conference. The other two cover the keynote speeches and Day 2 of the technical conference. Below is a recap of the first day’s sessions.
Indium to Feature Precision Gold-Based Die-Attach Preforms at IMS 2025
05/29/2025 | Indium CorporationIndium Corporation® will feature its high-reliability, gold-based precision die-attach preforms for critical laser and RF applications, as well as 5G communications, at the International Microwave Symposium, June 15-19, in San Francisco, CA.
Electroninks Acquires Complete UTDots Advanced Materials Nanoinks Portfolio and IP
05/19/2025 | ElectroninksElectroninks, the leader in metal organic decomposition (MOD) inks for additive manufacturing and advanced semiconductor packaging, announced it has officially completed its full acquisition of UTDots products and IP into its portfolio, further expanding its offerings in digital printing for high-performance applications.