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Technica USA to Attend SEMICON West 2027, Expanding Presence in the Semiconductor Market

10/26/2026 | Technica USA
Technica USA recently attended the SEMICON West Expo, where company representatives Jason Perry, President; Peter Chen, Equipment Service Manager; and Frank Medina focused on strengthening relationships with customers and supply partners while preparing for the company’s participation in SEMICON West 2027 that will take place March 30-April 1, in Phoenix, Arizona.

3 Key Takeaways: Understanding the Promise and Practical Limits of ELIC

10/26/2026 | I-Connect007
As semiconductor packages become smaller and more complex, PCB designers face increasing pressure to accommodate higher interconnect densities within tighter space constraints. Every layer interconnect (ELIC) technology offers a way to overcome some of the limitations of traditional HDI construction, but achieving greater density introduces new challenges in fabrication, reliability, and cost. In his white paper, ELIC: Every Layer Interconnect—The Promise, the Pain, and the Practical Limits, ASC President and CEO Anaya Vardya examines the advantages of ELIC architecture, the manufacturing challenges that accompany it, and the design decisions that determine whether a board can be produced reliably at scale.

Flex Connections: Is a Printed Silver Ink Circuit Right for Your Application?

10/27/2026 | Terrill Schmidt -- Column: Flex Connections
When is the right time to design a flexible circuit with printed ink, usually silver, vs. a flexible etched copper circuit, a die-cut copper circuit, or a die-cut aluminum circuit? First, a flexible circuit design must work in the application as designed and be cost-effective so the end product can be sold or used. What drives a designer to choose between an etched copper circuit, printed ink, flat flexible cable, die-cut copper, or die-cut aluminum? Multiple factors influence the design.

The Right Approach: The Top 5 Scariest Things About AI in PCB Fabrication

10/27/2026 | Steve Williams -- Column: The Right Approach
AI is already inside the PCB fabrication process, whether a shop has formally adopted it or not. Automated optical inspection (AOI) systems have used machine learning for years. CAM and DFM checks are increasingly AI-assisted, and quoting engines predict yield before a panel ever sees copper. None of that is inherently frightening; most of it is a genuine improvement over manual methods that were slower and just as fallible in their own ways.

It’s Only Common Sense: Every Salesperson Must Become a Teacher

10/26/2026 | Dan Beaulieu -- Column: It's Only Common Sense
Customers do not need more sales pitches. They need more clarity.  They are trying to navigate material shortages, component constraints, changing tariffs, longer lead times, new technologies, geopolitical uncertainty, and the enormous demands AI is placing on the electronics supply chain. Every day brings another warning, and much of the information is contradictory, exaggerated, or so technical that it creates more confusion than understanding.
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