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IPC Standards Released for Q2 2026

08/14/2026 | Global Electronics Association
Each quarter, the Global Electronics Association releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit electronics.org/ipc-standards. These are the latest releases for Q2 2026.

QTREX, DoD Lab Target Q4 2026 for Joint Quantum Program

08/13/2026 | Globe Newswire
QTREX Quantum Ltd. a company focused on advancing Additively Manufactured Electronics (AME) for quantum computing infrastructure, announced that it is in discussions with a U.S. Department of Defense’s research laboratory to establish a joint quantum development program.

NVIDIA Partners With Major Firms to Mobilize $500B for AI Infrastructure

08/13/2026 | NVIDIA
NVIDIA announced strategic partnerships to establish independent compute financing platforms with Apollo, BlackRock, Blackstone, Brookfield, Goldman Sachs and KKR to mobilize over $500 billion of third-party capital for the buildout of AI infrastructure over time.

BAE Systems Advances to Phase 2 of DARPA's THREADS Program

08/13/2026 | BAE Systems
BAE Systems' FAST Labs™ research, development and production organization has successfully completed Phase 1 of the Defense Advanced Research Projects Agency's (DARPA) Technologies for Heat Removal in Electronics at the Device Scale (THREADS) program and has been awarded continued support to move into Phase 2.

More Than Moore Enabled by Advanced Packaging and Heterogeneous Integration

08/13/2026 | Chetan Arvind Patil, Marvell Technology
For more than a half-century, Moore's Law has been the defining principle of semiconductor innovation. By continually shrinking transistor dimensions, the semiconductor industry delivered exponential improvements in computing performance, energy efficiency, and integration density. Each new technology node enabled more transistors to be placed on a single die, reducing the cost per transistor and making electronic systems smaller, faster, and more capable. Though this scaling continues to advance, it is no longer the sole driver of system-level innovation, which now increasingly comes from a combination of scaling and advanced packaging.