Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."

Simon Khesin - Schmoll Maschinen

Suggested Items

Gartner: ANZ LEO D2D Connections to Hit 1.5M by 2027

07/22/2026 | Gartner, Inc.
Low-earth orbit (LEO) direct-to-device (D2D) services in Australia and New Zealand are expected to deliver more than 670,000 connections in 2026, helping close the mobile connectivity gap in rural and regional communities, according to Gartner, Inc., a business and technology insights company.

Connected Cars with OEM Telematics to Reach 580M by 2030

07/20/2026 | Berg Insight
According to a new research report from the IoT analyst firm Berg Insight, the active installed base of connected cars based on embedded connectivity worldwide reached 338.0 million at the end of 2025.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

07/17/2026 | Nolan Johnson, SMT007 Magazine
The Pentagon’s announcement on Tuesday that CMMC certification is being immediately suspended is the big news of the week. We’ve been covering the CMMC journey since the beginning, and we’ll stick with the story for the duration. If you’ve followed my list of must-reads, you know that I’m always interested in semiconductor news, and this week had a few good ones. I’ll mention them here, and urge you to read the entire stories: Apple adds to the recent Intel fab agreement by adding to its U.S.-based design and manufacturing agreement with Broadcom; Micron is investing $3 billion to the U.S. semiconductor ecosystem; and Intel announces a 5 billion euro investment in European infrastructure.

Keysight, Sateliot Selected by ESA to Develop Blockchain-Enabled 5G NTN Framework

07/16/2026 | BUSINESS WIRE
Keysight Technologies, Inc. has been selected by the European Space Agency (ESA) to lead a three‑year development program focused on creating secure, blockchain‑enabled anomaly detection for 5G non‑terrestrial networks (NTN).

3 Key Takeaways: A New Approach to Die Topside Interconnection

07/15/2026 | I-Connect007
Every advance in power electronics places new demands on semiconductor packaging. As manufacturers push for greater power density, improved thermal management, and smaller form factors, even long-established interconnection methods deserve a fresh look. In its latest white paper, MacDermid Alpha Electronics Solutions examines how a sinter-ready copper foil solution could simplify die topside interconnection while improving performance.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in