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John Perry: From Mailing IPC Standards to Guiding Them
December 29, 2025 | Barry Matties, Community MagazineEstimated reading time: 2 minutes
John Perry's journey with the Global Electronics Association (formerly IPC) started when he was 8 years old, inspired by his mother's role in organizing IPC company meetings. Driven by his passion for aviation and standards, he went on to a career in computer science and IT. Today, he is the director of Printed Boards Standards & Technology for the Association, collaborating with industry leaders, including those at Lockheed Martin.
Barry Matties: John, you have a long history with the Global Electronics Association, thanks to your mother. Tell me how you got started.
John Perry: Yes, she (Virginia Bergman) was the manager of the Meetings Department. This was in the early 1980s, when we had two semiannual meetings in the spring and fall. There was no IPC APEX EXPO back then. She would scout and book the location, and put together the schedule for the entire event, including all the committee meetings for standards, the tech paper sessions, and any workshops. I'd come home from school, and the dining room table would just be laid out with all kinds of papers. She would also do the layout for the schedule onsite, which we on staff affectionately called the “Pocket Weasel,” because people could shove the schedule in their pockets. But there was no word processor for her to work on, no Microsoft Office. She was making corrections with Xacto blades and those little white strips. I think it was Avery’s white strips. The papers would be strewn out for weeks, and then she'd compile them all and bring them to the printers, and that was how she put together the onsite guide.
You were literally raised right in the mix?
Yeah. I would come home from school, look at that stuff on the table, and think, “What is that?” It was printed circuit board design and flex circuits, but it was a mystery to me. But it was intriguing, and I would think, “Someday, I might want to know what the heck that means.”
Continue reading this article in the Fall 2025 issue of Community Magazine.
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Hall of Fame Spotlight Series: Highlighting Karen McConnell
05/07/2026 | Dan Feinberg, I-Connect007In 2021, Karen McConnell was awarded the Raymond E. Pritchard Hall of Fame award in recognition of her contributions to the Association and the electronics industry. As a senior staff member and CAD/CAM engineer at Northrop Grumman Enterprise Services, her primary responsibility was to develop a common, shared EDM (Electronic Document Management) library to support the electrical and PCB design tool initiatives across Northrop Grumman Mission Systems.
A Necessary Shift From Gerber to IPC-2581
05/07/2026 | Tracy Riggan, Global Electronics AssociationIPC-2581 is an open, vendor-neutral data exchange standard developed by the Global Electronics Association to streamline the exchange of PCB design information across fabrication, assembly, and test. It replaces multiple legacy formats—including industry standards, Gerber, and ODB++—with a single, comprehensive, XML-based dataset that captures all manufacturing details.
When Quality Is Personal: The Human Stakes Behind Electronics Reliability
05/06/2026 | Kelly DackIn electronics manufacturing, quality is often discussed in terms of specifications, standards, and process controls, but as industry veteran Doug Pauls reminds us, the stakes are far more human. In this conversation, Doug, a recipient of the Global Electronics Association’s Hall of Fame Award, draws on more than four decades of experience to illuminate the real-world consequences of reliability, where even a single defect can carry profound implications. He brings into sharp focus why quality isn’t just a metric, but a responsibility shared by everyone on the manufacturing floor.
PCBAA, AAM Take on the Fight to Rebuild U.S. Manufacturing in New Documentary
05/05/2026 | Marcy LaRont, I-Connect007Throughout most of the 20th century, manufacturing was central to the American Dream of providing stable jobs and pathways to upward mobility. Today, more than 80% of global electronics manufacturing capacity resides in China and greater Asia, raising serious concerns about supply chain resilience and national security.
Vern Solberg: A Designer's Focus on High Density
04/30/2026 | Marcy LaRont, I-Connect007 MagazineVern Solberg is a distinguished member of the Global Electronics Association Raymond E. Pritchard Hall of Fame and has served as chair or vice chair of many committees, developing technical standards and implementation guidelines, including the IPC-7090 series, which focuses on design for manufacturing and reliability for electronic assemblies. He’s a long-time contributor to Design007 Magazine, and he conducted a half-day tutorial at APEX EXPO 2026, where he addressed 2D, 2.5D, and 3D packaging and ultra-high density hybrid bond interconnect. I caught up with Vern at the show and asked about his pivot from addressing more standard design challenges to his focus on high-density circuits.