Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."

Julia McCaffrey - NCAB Group

Suggested Items

Applied Materials Adds Samsung Electronics to $5B EPIC R&D Center

02/13/2026 | Applied Materials
Applied Materials, Inc. announced that Samsung Electronics will join the new, $5 billion EPIC Center in Silicon Valley. Applied’s EPIC Center will open this year as the world’s largest and most advanced facility for collaborative semiconductor process technology and manufacturing equipment R&D.

EIPC Winter Conference Review: A Focus on Miniaturization

02/12/2026 | Pete Starkey, I-Connect007
The theme of the first technical session of EIPC’s Winter Conference in Aix-en-Provence on Feb. 3 was “Miniaturisation and fine-line PCB production: From design to manufacturing.” The session was moderated by EIPC Vice President Thomas Michels, CEO of ILFA in Germany. The theme of the conference is “Driving the Future: Innovation, Energy, and Sustainability in PCB Technology.” The opening presentation came from applications engineering specialist Dr. Roland Steim of Dyconex in Switzerland, who described how the company has addressed the challenges of miniaturisation and fine-line PCB production.

New Research Group: AT&S Strengthens Microelectronics at TU Graz

02/11/2026 | AT&S
AT&S is setting another strategic milestone for the technological future of Europe and is funding the establishment of a new research group at Graz University of Technology (TU Graz) in the field of microelectronics with a focus on IC substrates and advanced packaging technologies.

STMicroelectronics Expands Strategic Collaboration with AWS for Cloud and AI Data Centers

02/10/2026 | STMicroelectronics
STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, announced an expanded strategic collaboration with Amazon Web Services (AWS) through a multi-year, multi-billion USD commercial engagement serving several product categories.

Honeywell, LIG Nex1 Establish Framework to Explore Unmanned Aerial Vehicle, Defense Technologies

02/09/2026 | Honeywell
Honeywell announced it has signed a Memorandum of Understanding (MOU) with LIG Nex1 to explore opportunities for future collaboration on the development and commercialization of solutions for the unmanned aerial vehicle (UAV) market, including Unmanned Combat Aerial Vehicles (UCAVs) and Collaborative Combat Aircraft (CCAs), as well as selected space, electromagnetic defense and cybersecurity applications.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in