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Advanced Electronics Packaging Digest

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VSMC Celebrates the Grand Opening of Its First 300mm Fab in Singapore

09/28/2026 | Globe Newswire
VisionPower Semiconductor Manufacturing Company Pte. Ltd. (VSMC), the joint venture established in September 2024 by Vanguard International Semiconductor Corporation (VIS) and NXP Semiconductors N.V., marked the grand opening of its first 12-inch (300mm) fab in Tampines, Singapore.

MKS Atotech Highlights Everplate Cu 300 2TF for Advanced Packaging

09/28/2026 | MKS Inc.
MKS Inc., a global provider of enabling technologies that transform our world, highlighted Everplate Cu 300 2TF from its Atotech brand.

Tata Electronics, Enomoto Sign MoU to Strengthen India Semiconductor Packaging

09/24/2026 | Tata Electronics
Tata Electronics, a pioneering leader in India’s electronics and semiconductor manufacturing sector, and Enomoto Co., Ltd., a leading Japanese precision semiconductor component manufacturer, have signed a Memorandum of Understanding (MoU) to advance the semiconductor packaging ecosystem in India, and support Tata Electronics’ packaging facility in Jagiroad, Assam. 

Siemens, TSMC Advance AI-powered Semiconductor Design Automation

09/24/2026 | Siemens
Siemens announced continued collaboration with TSMC to drive innovation in AI-powered automation and advanced semiconductor design enablement.

GSME, Teradyne Announce Strategic Partnership

09/23/2026 | PRNewswire
GS Microelectronics U.S., Inc., a fast-growing semiconductor solutions provider, and Teradyne, Inc., a leading provider of automated test equipment and advanced robotics, today announced a multi‑year strategic partnership to establish a state‑of‑the‑art semiconductor test and evaluation center designed to accelerate customer time‑to‑market.
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