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Marcy’s Musings: Setting the Pace for an Industry in Motion

For many years, I-Connect007 publications have supported an industry built on thoughtful engineering, practical insight, and open discussion of real-world design and manufacturing challenges. We aim to strengthen the industry and its companies by sharing information that informs, guides, and drives better decisions.

We’ve purposely served the industry through its distinct sectors: PCB design, fabrication, and assembly. However, there are no longer distinct silos of work in the electronics manufacturing sector. I’ve increasingly found myself in discussions about the topic of “blurred lines” between disciplines, and the reality that work done in a vacuum has a diminished chance of success.

“Today, we are entering a profound paradigm shift, not simply limited to PCB layout or assembly,” writes John Watson in this month’s issue. “It is redefining how PCB design fits into the broader electronic system.” The Global Electronics Association’s Matt Kelly and Peter Tranitz have been advocating this view for over a year, as have other advocacy groups, including PCBAA and EIPC, repeatedly discussing the concept of “silicon to systems” and the emerging need for a holistic consideration of all electronic devices, from concept through end-of-product-life issues.

In essence, there is no meaningful PCB design without a solid framework for design for manufacturability that encompasses the entire spectrum of hardware design and fabrication. A PCB design is only wasted time and data bits if it is not realized by being built.

In contrast, every realized printed circuit board begins with a design and a discussion with the designer/OEM/ordering party regarding the viability of building that board based on the provided information. It is based on the design that PCBs are priced, the supply chain verified, and lead times provided. Now, end customers begin to plan their time-to-market and ultimate profitability more concretely.

Design and fabrication have always been inextricably linked, but our customers are demanding that we tighten the ranks and be more closely aligned than ever before to achieve the success they now require. The stakes have never been higher in terms of end-product reliability and cost.

To that end, we are excited for the launch of I-Connect007 Magazine, which brings our Design007 Magazine and PCB007 Magazineunder a single title. It enables us to present a more comprehensive view of the PCB and interconnect lifecycle while maintaining the depth, technical rigor, and practical focus that you expect.

Within these pages, you’ll find the same trusted voices, along with perspectives from across the design and manufacturing spectrum. From stackups and HDI strategies to standards and materials, as well as defect reduction and the exploration of advanced manufacturing techniques, our goal remains unchanged: to provide information that is relevant, credible, and useful in your day-to-day work.

As technology and manufacturing knowledge evolve, approaching these subjects—from the front end in PCB design to the back end through the factory floor—will provide a comprehensive picture of complex topics.

In this month’s issue, we asked designers, fabricators, and suppliers what they see for 2026 and beyond and you’re likely to see your own thoughts reflected in their commentary. On the design side, you’ll find articles ranging from the greatest challenges to PCB designers to technical topics on 3D design and pattern plating, optimization to the IPC-2152 specification, and the evolution of flexible circuits. We also give you a preview of the Design Village at APEX EXPO.

In PCB fabrication, fabricators and suppliers also look ahead at the challenges of adapting to changes we cannot yet see, whether that’s in additive manufacturing technology, building machines for the next phase of technology, or where PCB fabrication will lead in Europe.

There’s plenty of other tidbits throughout this issue as we now better reflect what’s happening in our industry. Thank you for continuing to read, contribute, and engage with us. I look forward to exploring together where the industry is headed.

This column originally appeared in the January 2026 issue of I-Connect007 Magazine.