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Suggested Items

Skoltech Team Develops Modulator for Compact Photonic Integrated Circuits

04/28/2026 | Skoltech
Researchers at Skoltech have developed an ultra-compact electro-optic modulator based on silicon photonics and plasmonics that enables high-efficiency optical signal control within a small device footprint.

Applications, Challenges, and the Future of Flex–Packaging Integration, Part 2

04/16/2026 | Anaya Vardya, American Standard Circuits
In the second of this two-part series, Anaya Vardya of American Standard Circuits examines applications, challenges, manufacturing considerations, and future trends emerging from the convergence of flexible printed circuit boards and advanced semiconductor packaging. Applications driving the convergence include consumer electronics, automotive systems, medical, wearables, aerospace and more.

BEST Inc. Publishes Optimizing BGA Rework Techniques to Ensure Quality Tech Paper

04/15/2026 | BEST Inc.
BEST Inc., a leader in electronic component and PCB services, is pleased to announce they have published a tech paper describing techniques for reworking BGA components to ensure quality during the printed circuit board rework process.

Huawei, LG Electronics and Nokia Named as Founder Licensors of New Sisvel POS Pool

04/01/2026 | BUSINESS WIRE
Three world-class innovators are the founder licensors of the new Point of Sale (POS) patent pool, covering 2G to 5G technology, which Sisvel has launched today.

Asia/Pacific PC Market Up 11.6% in 2025; Supply and Pricing Challenges Loom for 2026

03/24/2026 | IDC
The Asia/Pacific (including Japan and China)  traditional PC market (desktops, notebooks, and workstations) grew by 11.6% in 2025 to 106.6 million units, according to the International Data Corporation (IDC) Worldwide Quarterly Personal Computing Devices Tracker, Q4 2025.
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