Unlock Breakthrough Electronics Innovation at the APEX EXPO 2026 Technical Conference

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Electronics engineers, technologists, and industry leaders have a strategic advantage at this year’s Advanced Electronic Packaging Conference 2026, the premier technical conference at APEX EXPO 2026, where 80+ original technical papers, cutting-edge insights, and peer-reviewed research converge to accelerate product performance, solve manufacturing challenges, and drive competitive differentiation. This year’s conference opens on Monday, March 16 and runs through Thursday, March 19. 

What’s in it for attendees:

• Immediate technical value: Industry thought leaders will present practical data, new methods, and unpublished results across advanced packaging, PCB fabrication, reliability, sustainability, AI and automation, materials, and next-gen assembly technologies. 
• Career and business impact: Participants will gain insights they can apply directly to design, manufacturing, test, and production strategies to improve yields, reliability and time to market. 
• Expanded networking: Connect with global innovators, peers, technology suppliers, and standards leaders. 

Conference highlights:

• Opening session technical keynotes: From Silicon to Systems: Advanced Electronic Packaging for Next-Gen Compute — a forward-looking primer from Dr. David Lokken-Toyli, Principal Research Scientist, IBM, on how packaging and surface mount technologies are scaling to meet the demands of heterogeneous integration, quantum systems and next-generation compute platforms. Advanced Packaging: A Crucial Enabler for Heterogeneous Integration — from Dr. Ravi Mahajan, Intel Fellow & Director of Assembly and Packaging Technology Pathfinding, focuses on advanced packaging as a key enabler of heterogeneous integration, highlighting evolving architectures, interconnect scaling challenges, and new industry–academia collaboration opportunities.
• 80+ technical paper presentations: Covering electrical and thermal design, plating and surface finishes, SMT processes, power electronics, metrology, quality and reliability, sustainability, factory automation and more. 
• Two special sessions: Focused discussions on aerospace/defense electronics and automotive/electric vehicle packaging challenges.

“APEX EXPO’s Advanced Electronic Packaging Conference delivers the actionable insights and technical depth that engineers and technologists need to innovate with confidence and impact,” said Matt Kelly, CTO and vice president, standards and technology solutions and APEX EXPO conference general chair. “This year’s program spans the most critical topics shaping tomorrow’s electronics — from component-level and system-level integration to sustainability and automation — and represents a powerful opportunity to elevate your work and your business.”

Event Details:
• Dates: March 16–19, 2026 
• Venue: Anaheim Convention Center, Anaheim, California. 
• Registration: Available now