Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."

Julia McCaffrey - NCAB Group

Suggested Items

Polar, IC-Link by imec Partner on 8-Inch GaN Manufacturing

10/19/2026 | Polar Semiconductor, LLC
Polar Semiconductor, LLC (Polar), a U.S.-owned and operated foundry specializing in high-voltage, power, and sensor technologies, and IC-Link by imec, imec’s design and manufacturing service, announced they are collaborating to provide 8-inch production of enhancement-mode (e-mode) GaN devices to serve critical markets such as AI data centers, automotive, aerospace & defense, and the industrial grid.

Imec, Diraq Demonstrate First Coherent Operation of 8 Silicon Spin Qubits

07/16/2026 | Imec
Imec, a world-leading research and innovation hub for advanced semiconductor technologies, and Diraq, a pioneer of silicon-based quantum computing, announce they have demonstrated the coherent operation and readout of an eight silicon MOS spin-qubit array designed and fabricated on imec's advanced 300mm spin-qubit technology platform using a CMOS-compatible process.

Imec Achieves Breakthroughs in Ferroelectric Memory Research for AI-Era Data Needs

06/26/2026 | Imec
Ferroelectric memory is drawing increasing attention as AI workloads place unprecedented pressure on memory systems to deliver more capacity, higher bandwidth, and better energy efficiency at sustainable cost.

Imec Achieves Breakthroughs in Ferroelectric Memory for AI-Era Needs

06/22/2026 | Imec
At the 2026 IEEE / JSAP symposium on VLSI Technology & Circuits, imec, a world-leading research and innovation hub in advanced semiconductor technologies, presents two advances in ferroelectric memory research, targeting both ferroelectric capacitors and ferroelectric field-effect transistors as emerging candidates to enable low-voltage operation and high-density integration.

Imec, EVG Demo Wafer-to-Wafer Hybrid Bonding at 200nm Pitch with Record Overlay Accuracy

05/28/2026 | PRNewswire
This week, at the 2026 IEEE Electronic Components and Technology Conference (ECTC), imec, a world-leading research and innovation hub in advanced semiconductor technologies, and EV Group (EVG), leading provider of semiconductor manufacturing equipment and process solutions, present a robust and highly yielding wafer-to-wafer hybrid bonding technology at 200nm Cu interconnect pad pitch, demonstrated on a test vehicle with routable interconnects.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in