-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
From Silos to Systems: 2026 and Beyond
Welcome to the debut issue of I-Connect007 Magazine. This publication brings all of the pieces together from PCB design and fabrication for a closer alignment and a more integrated electronics manufacturing landscape.
The Automation Advantage
In this issue, we discover how AI, machine learning, and practical factory automation are reshaping PCB fabrication, and where these tools can meaningfully move your business forward.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
Taiwan Pushes Back on U.S., Citing 40% Goal ‘Impossible’
February 10, 2026 | I-Connect007Estimated reading time: 1 minute
Taiwan has pushed back strongly against U.S. calls to shift a large share of its semiconductor manufacturing capacity to American soil, saying such a move is unrealistic and would undermine an ecosystem built over decades, according to a recent Reuters news article.
In an interview aired on Taiwanese television channel CTS, Vice Premier Cheng Li-chiun said it would be “impossible” to relocate 40% of Taiwan’s chipmaking capacity to the United States, responding to recent statements by senior U.S. officials advocating for a major production shift.
According to Reuters, Cheng emphasized that Taiwan’s semiconductor ecosystem, spanning advanced manufacturing, packaging, and the broader supply chain, cannot simply be moved overseas. “Our overall capacity (in Taiwan) will only continue to grow,” she said in the article. “But we can expand our presence in the United States.” Cheng added that overseas expansion would not come at the expense of Taiwan’s domestic base and that they will “remain firmly rooted in Taiwan and continue to expand investment at home.”
The remarks follow those of U.S. Commerce Secretary Howard Lutnick, who has argued that the concentration of semiconductor manufacturing near China poses strategic risks. “You can’t have all semiconductor manufacturing 80 miles from China,” Lutnick said in the Reuters article. “That’s just illogical … So we need to bring it back,” adding that the administration’s goal is to achieve “40% market share in leading-edge semiconductor manufacturing” by the time it leaves office. Earlier proposals for a 50-50 production split were rejected by Taipei.
While Taiwan recently agreed with Washington to reduce tariffs on its exports to 15% from 20% and to increase U.S. investment, Cheng said there would be no relocation of Taiwan’s science parks. Instead, Taiwan is willing to share its experience in building semiconductor industry clusters to help the U.S. develop its own. Reuters said the U.S. has threatened to impose higher tariffs if it does not get what it wants.
TSMC, the world’s largest contract chipmaker, is already investing $165 billion in new fabs in Arizona, highlighting Taiwan’s willingness to expand abroad, while keeping its semiconductor core firmly at home.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
SEMI Europe Recognizes Tyndall and imec for Their Contributions to the Semiconductor Industry
03/13/2026 | SEMISEMI Europe announced the winners of the SEMI European Award 2025 and Special Service Award at the SEMI Industry Strategy Symposium Europe (ISS Europe) 2026 in Sopot, Poland.
Qnity Expands Domestic Manufacturing Footprint to Accelerate Semiconductor Industry Growth
03/12/2026 | BUSINESS WIREQnity Electronics, Inc., a premier technology solutions leader across the semiconductor value chain, celebrated the opening of its new 385,000-square-foot facility with a ribbon-cutting ceremony in Newark, Delaware.
Polar Semiconductor Earns AS9100D Certification for Wafer Manufacturing
03/12/2026 | BUSINESS WIREPolar Semiconductor is pleased to announce that its Quality Management System (QMS) has achieved certification conforming to AS9100D and ISO 9001:2015 for the manufacture of semiconductor wafers.
India Advances Toward 85,000 Semiconductor Engineers Under C2S
03/12/2026 | PIB DelhiGovernment of India’s initiative for prioritizing talent development through Training, Up-skilling and Workforce Development Programs under Chips to Startups (C2S) initiative of India Semiconductor Mission (ISM), Union Minister for Railways, Information & Broadcasting, and Electronics & IT, Ashwini Vaishnaw, stated that India has made significant progress in last 04 years itself for its 10-year target of training 85,000 engineers in semiconductor design.
Mitsui Backs Kaynes’ Semiconductor Back-End Manufacturing in India
03/10/2026 | MitsuiMitsui & Co., Ltd. has concluded a strategic business partnership agreement with Kaynes Semicon Private Limited , which is engaged in the semiconductor back-end process (OSAT*) business in India, and AOI Electronics Co., Ltd.,