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The Chemical Connection: The Consequences of Additive Metallizing on Etching Steps

06/01/2026 | Don Ball -- Column: The Chemical Connection
This month, I’m taking another look at additive manufacturing. What does mSAP, SAP, and additive metallizing (plating) look like in today’s advanced PCB fabrication? I must confess I don’t have a lot of insight, as my whole career has been devoted to removing copper from panel surfaces in even and controlled ways, and not to putting copper back on the panel. However, at some point in the additive process, especially in additive plating, copper must be removed from between the conducting surfaces to complete the circuits. Here, I can address some of the consequences of additive metallizing on subsequent etching steps.

ASE Launches Automated 310mm Panel-Level Packaging to Accelerate AI Innovation

05/27/2026 | BUSINESS WIRE
Advanced Semiconductor Engineering, Inc. (ASE), a member of ASE Technology Holding Co., Ltd. and a leading provider of semiconductor assembly and test services, announced the development of an industry-first automated 310mm × 310mm panel-level packaging production line, advancing its leadership in next-generation advanced packaging technologies.

FKN Systek K4000: Depaneling V-Scored PCBs with Overhanging Components

05/19/2026 | FKN Systek
FKN Systek introduces the K4000 PCB depanelizer. Custom EDM slots on a K4000 Linear blade enhance the depaneling process, providing space to clear the cutting path for parts overhanging the score line of a panelized PCB, thus enabling the separation of skip-scored PCB panels with overhanging components.

Cirtronics Brings Commercialization Discussion to Robotics Summit & Expo 2026

05/14/2026 | Cirtronics
Cirtronics, a leading electronics contract manufacturer specializing in complex robotics systems, will sponsor and lead a featured panel discussion at the 2026 Robotics Summit & Expo, taking place May 27–28 at the Thomas M. Menino Convention & Exhibition Center in Boston.

SEMI ESD Alliance 2026 Outlook: Agentic AI to Transform Chip Design and Verification

05/01/2026 | SEMI
The Electronic System Design Alliance (ESD Alliance), a SEMI Technology Community, announced its annual Executive Outlook event for semiconductor EDA, agentic AI and IP company executives.
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