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Trouble in Your Tank: HDI and UHDI—Building the Foundation of Advanced Packaging

10/12/2026 | Michael Carano -- Column: Trouble in Your Tank
The electronics industry ecosystem has never been more robust or dynamic. AI is a major factor in this rapid growth, fueling advances in high performance computing (HPC), advanced memory, high speed networking, and optical interconnects. In addition, advanced semiconductor packaging and data center build-out are pushing HDI and UHDI fabrication to circuit densities not seen previously.

Flex PCB Body Panels in CubeSats

10/08/2026 | Anaya Vardya, American Standard Circuits
A standard CubeSat (nanosatellite) leaves an engineer with almost no room for compromise. A 1U unit is a 10 cm cube; even a 6U or 12U bus measures its budget in grams and cubic centimeters, not the kilograms and racks available to a traditional satellite. Every wire harness, connector, and mounting bracket is mass and volume that could otherwise carry a sensor, a radio, or extra battery capacity. That pressure is what has pushed flexible printed circuits out of the wiring harness and onto the structure itself, turning the body panels that form a CubeSat's outer skin into functional electronic assemblies.

United Electronics Corporation Installs New Automated Pumice Surface Preparation Line

10/08/2026 | United Electronics Corporation
New Circuit Tech International Pumice Line and 50-Panel Unloader Deliver Consistently Prepared Copper for Stronger Solder Mask Adhesion

SEMI Joins EU STEAM Panel to Advance Semiconductor Workforce

10/07/2026 | SEMI
SEMI, the industry association advancing the global semiconductor and electronics design and manufacturing supply chain, announced that SEMI Europe has joined the European Commission's newly established STEAM Executive Panel bringing the semiconductor industry’s perspective to discussions on skills, education, and workforce development.

Nordson Electronics Solutions to Showcase Dispensing and Plasma Systems at SEMICON West 2026

09/25/2026 | Nordson Electronics Solutions
Nordson Electronics Solutions, a global leader in reliable electronics manufacturing technologies, will feature two new systems designed to address the demanding requirements of panel-level packaging (PLP) and other advanced semiconductor packaging applications.
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