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February Issue of Advanced Electronics Packaging Digest Examines the Evolving Role of Packaging
February 11, 2026 | I-Connect007 Editorial TeamEstimated reading time: 1 minute
I-Connect007 is excited to announce that the upcoming issue of Advanced Electronics Packaging Digest (AEPD) will be delivered to subscriber inboxes on Feb. 16, offering in-depth perspectives on the technologies and system-level thinking shaping the future of electronics packaging.
As performance demands rise, advanced packaging is increasingly central to integration across the electronics ecosystem. This issue of AEPD examines how packaging decisions increasingly influence design, materials selection, manufacturing strategy, and overall system performance.
Anaya Varda, president of American Standard Circuits, explores this convergence in “Foundations and Drivers of the PCB Flex–Advanced Packaging Nexus, Part 1,” examining how flexible PCBs and advanced semiconductor packaging are evolving together to support higher density, smaller form factors, and greater functional integration. The article outlines the technical foundations behind this shift and the forces accelerating closer coordination across design and manufacturing.
In “APEX EXPO 2026 Tech Conference: Changing the Electronics Systems Conversation,” Matt Kelly, CTO of the Global Electronics Association, and Devan Iyer, chief strategist for advanced packaging, discuss how the APEX EXPO 2026 Technical Conference reflects a broader industry move toward a “silicon-to-systems” perspective. Drawing on insights from recent global workshops and technical sessions, the article highlights how the conference brings component-level and system-level experts together to address emerging challenges across advanced electronics packaging.
Technical consultant Vern Solberg continues his examination of heterogeneous integration in “Heterogeneous Interposer Design Challenge, Part 2,” building on the industry’s evolution from monolithic system-on-chip designs to complex architectures that integrate processing, memory, sensing, and communication functions across advanced substrates and interposers.
Published by I-Connect007, Advanced Electronics Packaging Digest delivers expert-driven coverage of the technologies, standards, and strategic considerations shaping advanced electronics packaging and system integration. The February issue will be delivered to subscribers on Monday, Feb. 16. To subscribe, click here.
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