It’s Only Common Sense: Customers Capabilities—and Confidence
Dan’s Biz Bookshelf: ‘The 'NVIDIA Way: Jensen Huang and the Making of a Tech Giant’
Amkor Technology Announces Q4 and Full-Year 2025 Financial Results
February 13, 2026 | Amkor TechnologyEstimated reading time: 1 minute
Amkor Technology, Inc., a leading provider of semiconductor packaging and test services, announced financial results for the fourth quarter and full year ended December 31, 2025.
Fourth Quarter 2025 Highlights:
- Fourth quarter net sales $1.89 billion, up 16% year-on-year
- Net income $172 million, earnings per diluted share $0.69
Full Year 2025 Highlights:
- Net sales $6.71 billion, up 6% year-on-year
- Gross profit $939 million, operating income $467 million
- Net income $374 million, earnings per diluted share $1.50
- EBITDA $1.16 billion
- Net cash from operations $1.10 billion, free cash flow $308 million
“2025 was a pivotal year for Amkor. We delivered strong results with record Advanced packaging and Computing revenue, executed on our strategic initiatives, and strengthened our position in the fastest growing areas of the semiconductor industry,” said Kevin Engel, Amkor’s president and chief executive officer. “We enter 2026 with momentum and are accelerating strategic investments to support the next wave of advanced packaging growth.”
At December 31, 2025, total cash and short-term investments was $1.99 billion, and total debt was $1.45 billion.
On November 12, 2025, Amkor’s Board of Directors announced a 1% increase in the quarterly cash dividend on the company’s common stock, from $0.08269 per share to $0.08352 per share. The increased quarterly dividend was effective with dividend paid on December 23, 2025. The declaration and payment of future dividends, as well as any record and payment dates, are subject to the approval of the Board of Directors.
Business Outlook
The following information presents Amkor’s guidance for the first quarter 2026 (unless otherwise noted):
- Net sales of $1.60 billion to $1.70 billion
- Gross margin of 12.5% to 13.5%
- Net income of $45 million to $70 million, or $0.18 to $0.28 per diluted share
- Full year 2026 capital expenditures of approximately $2.5 billion to $3.0 billion
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Webinar Review, Part 2: Building the AI Backbone at IBM on Systems-level Packaging
04/20/2026 | Marcy LaRont, I-Connect007The second presentation in a recent Global Electronics Association’s Executive Pulse webinar series widened the lens on advanced packaging, moving beyond the component level to a systems-level view of how AI is reshaping the electronics landscape. Building on Dr. Hemanth Dhavaleswarupu of AMD’s previous discussion of chip-level packaging innovation, Dr. Jung Yoon of IBM explored the broader infrastructure implications, from the data center floor to the global supply chain.
Applications, Challenges, and the Future of Flex–Packaging Integration, Part 2
04/16/2026 | Anaya Vardya, American Standard CircuitsIn the second of this two-part series, Anaya Vardya of American Standard Circuits examines applications, challenges, manufacturing considerations, and future trends emerging from the convergence of flexible printed circuit boards and advanced semiconductor packaging. Applications driving the convergence include consumer electronics, automotive systems, medical, wearables, aerospace and more.
From AI to AEP, an Impressive Array of Keynotes at APEX EXPO 2026
04/17/2026 | Marcy LaRont and Nolan Johnson, I-Connect007Each year at APEX EXPO, the Global Electronics Association provides an impressive lineup of keynote speakers to kick off the largest electronics manufacturing event in North America. This year included four keynote speeches, on topics ranging from the promise and peril of AI to the power of electronics, quantum computing, and the importance of heterogeneous integration in advanced electronics packaging.
AI, Connectivity, and Systems-Level Thinking: New Frontiers in Advanced Packaging
04/16/2026 | I-Connect007 Editorial TeamThe upcoming issue of Advanced Electronics Packaging Digest examines key developments shaping the next phase of electronics innovation, from the reliability challenges of AI-driven packaging to emerging connectivity standards and the broader systems-level implications of artificial intelligence.
Indium Showcases Solder Alloy Reliability Research for Heterogeneous Integration at ICEP-HBS
04/15/2026 | Indium CorporationIndium Corporation Senior Global Product Manager, Semiconductor and Advanced Materials, Sze Pei Lim will present a collaborative International Electronics Manufacturing Initiative (INEMI) project comparing SnBi and SAC305 solder alloys for first-level interconnects in complex heterogeneous packages.