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Suggested Items

Nomenil Aims to Make Additive Manufacturing Production-Ready

07/09/2026 | Marcy LaRont, I-Connect007
Can additive manufacturing finally move beyond niche applications and into mainstream PCB production? Nomenil founders Bas Le Grand and Dr. Luca Gautero believe the answer lies not in the hardware, but in the software. Drawing on years of inkjet experience, they're developing tools designed to make additive manufacturing more predictable, scalable, and accessible for manufacturers.

Every Layer Interconnect: The Promise, the Pain, and the Practical Limits

07/02/2026 | Anaya Vardya, American Standard Circuits
Every layer interconnect (ELIC) is an architectural statement about how a PCB is built, signaling a fundamental shift in how we think about routing density, vertical interconnect, and the relationship between design and fabrication. To understand what ELIC solves, you have to understand what it replaces. Traditional HDI construction uses a rigid core with sequential build-up layers on one or both sides:configurations such as 2-4-2 or 3-2-3.

Elementary, Mr. Watson: PCB Education in the Midst of the Storms

06/17/2026 | John Watson -- Column: Elementary, Mr. Watson
I should probably begin with an apology, because this may be a tough pill to swallow and not the small vitamin kind. This is one of those honking, huge pills that could choke a mule. My goal is not to criticize students, dismiss academia, or blame industry. In many ways, I am part of all three conversations. I teach students trying to find their way. I work in academia and believe deeply in the value of education. I also come from an industry that needs skilled PCB designers more than ever, yet sometimes seems surprised when they do not simply appear out of the mist, holding a completed layout, a clean DRC report, and 10 years of experience.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

06/05/2026 | Marcy LaRont, I-Connect007
It’s Friday, the sun is out here in Arizona, and AI is on my mind (and always in the news). So, AI seems like a good place for me to focus this week. My first recommendation for this week is an article I wrote about the e-glass (and copper foil) shortage now plaguing laminate and PCB fabricators as a result of the global market’s very heavy focus on AI-related tech, hardware products, and supporting infrastructure.

Trouble in Your Tank: In Complex Systems, Design Rules Aren’t Optional

05/06/2026 | Michael Carano -- Column: Trouble in Your Tank
There is no question that the electronics industry, especially in circuit board design and fabrication, advanced packaging, and innovation throughout the value chain, has seen a significant transformation, whether it be in materials, system architecture, HDI and ultra HDI, semiconductors, or chiplets. AI and high-performance computing (HPC) are driving change across several fronts, including material properties, assembly techniques (think hybrid bonding), and power management.
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