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Trouble in Your Tank: At 40 GHz, Everything Matters, Part 1

07/07/2026 | Michael Carano -- Column: Trouble in Your Tank
The electronics industry supply chain is moving very quickly with the explosion of AI servers, high-performance computing, ADAS, quantum computing, and 5G/6G. Signal integrity is under scrutiny in an entirely new role. With many factors influencing signal integrity, one area that contributes to signal distortion at high frequencies is the PCB’s final finish layer deposits. Frequencies above 40 GHz are susceptible to such distortions, and data transfer rates of 224 GB/s are driving changes in PCBs and IC substrates.

Rewriting Metallization, One Ink at a Time

06/09/2026 | Marcy LaRont, I-Connect007 Magazine
Additive manufacturing has long promised to reshape how electronics are built, but that promise has remained just out of reach for many in the PCB industry who are limited by materials, performance trade-offs, and real-world manufacturability. Electroninks aims to change that equation by rethinking metallization at the chemical level by developing metal-complex inks that challenge established approaches and open new possibilities for advanced packaging, interconnects, and beyond.

Trouble in Your Tank: Understanding Interconnect Defects, Part 2

12/03/2025 | Michael Carano -- Column: Trouble in Your Tank
Part 1 of this two-part series presented a more detailed look at the underlying causes of interconnect defects (sometimes known as interplane separation), with these three modes of interplane separation: Type 1: Separation of the electroless copper deposit from the interconnect; Type 2: Separation of the electrolytic copper deposit from the electroless copper deposit, but the electroless remains on the post; Type 3: Cohesive failure of the electroless, whereby the electroless copper deposit actually separates from itself.

Trouble in Your Tank: Understanding Interconnect Defects, Part 1

11/04/2025 | Michael Carano -- Column: Trouble in Your Tank
This month, I’ll address interconnect defects (ICDs). While this defect continues to rear its ugly head, don’t despair. There are solutions, most of which center on process control and understanding the relationship of the chemistry, materials, and equipment. First, though, let’s discuss ICDs.

JSR/Inpria, Lam Research Enter Cross Licensing and Collaboration Agreement to Advance Semiconductor Manufacturing

09/16/2025 | JCN Newswire
JSR Corporation, a leading technology company focused on material innovation and the parent company of Inpria Corporation, a metal oxide photoresist solution provider, Lam Research Corp., a global leader in semiconductor fabrication equipment and services, announced that JSR/Inpria and Lam have entered into a non-exclusive cross-licensing and collaboration agreement to advance leading-edge semiconductor manufacturing.
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