Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "

Sweeney Ng - CEE PCB

Suggested Items

Cadence, TSMC Collaborate on Certified Tools and Silicon-Proven UALink IP

09/25/2026 | Cadence Design Systems
Cadence announced an expanded partnership with TSMC to deliver advanced capabilities for AI and HPC designers.

Cadence PCIe 6.0 Subsystem Achieves First-Pass Compliance

09/02/2026 | Cadence Design Systems
Cadence announced that its PHY and controller IP for the PCI Express® (PCIe®) 6.0 specification, implemented in the TSMC N3 process, achieved first-pass success at the recent PCI-SIG® compliance workshop held in late July.

Cadence Reports Q2 2026 Financial Results

07/28/2026 | Cadence Design Systems
Revenue of $1.584 billion, compared to revenue of $1.275 billion in Q2 2025.

Rapidus, Cadence Partner on Agentic AI for Advanced SoC Design

07/20/2026 | Cadence Design Systems
Rapidus Corporation and Cadence announced a collaboration to advance agentic AI for advanced-node system-on-chip (SoC) design by integrating the Cadence® InnoStack™ AI Super Agent into the Rapidus AI-Agentic Design Solution (Raads).

Cadence Launches AuraStack AI Super Agent

07/16/2026 | Cadence Design Systems, Inc.
The AuraStack AI Super Agent is the world's first agentic AI platform for PCB and advanced packaging design.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in