APEX EXPO 2026, Flagship Event for the Global Electronics Association, Showcases the Future of Advanced Electronic Packaging

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APEX EXPO 2026 will mark a defining moment for the global electronics industry as the first APEX EXPO since IPC’s rebrand as the Global Electronics Association, underscoring the organization’s expanded mission as the voice of the worldwide $6 trillion electronics industry.

The conference’s technical program has evolved significantly for 2026, debuting as the Advanced Electronic Packaging Conference 2026. The reimagined program reflects the industry’s accelerating shift toward end-to-end, component-to-system-level integration, linking materials, interconnects, architectures, and finished systems. More than 80 peer-reviewed technical papers across 25 sessions will deliver practical, real-world insights focused on performance, reliability, and leading-edge research across the electronics ecosystem.

“APEX EXPO 2026 reflects how rapidly our industry is evolving, from discrete manufacturing steps to fully integrated electronic systems,” said John W. Mitchell, Global Electronics Association president and CEO. “This year’s conference brings together the people, technologies, and ideas that are defining the future of electronics, and it does so at a scale and depth that’s unmatched anywhere in North America.”

The conference kicks off Monday, March 16 with two keynote presentations that set the technical and strategic direction for the week:

• Dr. David Lokken-Toyli, IBM, will explore how packaging and SMT enable next-generation compute platforms, from heterogeneous integration to quantum systems.
• Dr. Ravi Mahajan, Intel, will follow with insights on advanced packaging as a critical enabler for interconnect scaling and industry–academia collaboration.

On Thursday, two special sessions will spotlight sector-specific requirements driving advanced packaging innovation: Advanced Electronic Packaging for Aerospace & Defense Electronics and The Future of EV and Automotive Electronics. These sessions will examine how packaging technologies are engineered to meet extreme reliability, long product life cycles, and demanding thermal and environmental conditions. The 2026 program also features technical contributions from industry leaders including AMD, Collins Aerospace, Hyundai Mobis, IBM, Intel, Lenovo, Qualcomm, Raytheon Technologies Corporation, Robert Bosch GmbH, The Aerospace Corporation, and Toyota Motor Corporation.

Added Mitchell, “Together, the enhanced technical program, expanded show floor, and new on-site experiences make APEX EXPO 2026 the most comprehensive and integration-focused event in the conference’s history.”

The APEX EXPO show floor continues to expand as the largest electronics manufacturing event in North America, with hundreds of exhibitors showcasing next-generation equipment, materials, assembly, and test solutions. New for 2026 is the Design Village and Technology Pavilion, highlighting advances in design and simulation from advanced packaging through system-level integration. By popular demand, the Learning Lounge returns, offering expanded opportunities for practical education, expert-led discussions, and high-value networking.

Registration is now open. Learn more at www.apexexpo.org.