-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
NCAB Group White Papers: Practical PCB Design Guidance for Manufacturable Results
February 25, 2026 | I-Connect007 Editorial TeamEstimated reading time: 2 minutes
The I-Connect007 Industry Resource Center brings together expert white papers that help engineers and manufacturers navigate today’s design and manufacturing challenges across the PCB lifecycle.
NCAB Group contributes a valuable collection of white papers focused on practical PCB design and manufacturability. Drawing on their experience with a global network of production partners, NCAB helps engineers align design intent with fabrication realities: reducing risk while improving consistency and long-term reliability.
In “Semi-Flex Design Guidelines,” the team addresses applications that require limited bending without the added cost and complexity of fully flexible circuits. The paper explains how designers can select thin rigid FR-4 materials to enable controlled bending during installation, while emphasizing that semi-flex designs are best suited for static or limited-bend applications. Key considerations include minimum bend radius, copper distribution in bend areas, layer symmetry, and the use of flexible solder mask or coverlay to reduce mechanical stress.
NCAB extends its design-for-manufacturing approach in “Ultra HDI Design Guidelines,” which tackles the challenges of shrinking geometries and increasingly dense interconnect structures. The paper outlines practical design rules for microvias, pad sizes, dielectric thicknesses, and stackups that support both manufacturability and electrical performance as designs move beyond traditional HDI limits.
In “Stackups and Impedance Design Guidelines,” the focus is on the structural foundations that support signal integrity. This paper explains how symmetrical stackups, controlled dielectric spacing, and consistent copper weights help designers meet impedance targets while minimizing warpage in high-speed and high-frequency applications.
In “Multilayer Design Guidelines,” the authors address copper balance, via strategies, and drilling tolerances. These fundamentals help designers achieve stable manufacturing outcomes as board complexity and layer counts continue to increase.
Together, NCAB Group’s white papers reflect a design-for-manufacturing mindset. By translating fabrication constraints into actionable design guidance, the authors help engineers improve reliability, reduce rework, and achieve more predictable results.
Visit the I-Connect007 Industry Resource Center to explore these resources—and many more—designed to strengthen your PCB design strategy.
Testimonial
"Your magazines are a great platform for people to exchange knowledge. Thank you for the work that you do."
Simon Khesin - Schmoll MaschinenSuggested Items
Dragonfly Energy Secures Additional Nevada Tech Hub Funding
05/07/2026 | Globe NewswireDragonfly Energy Holdings Corp., an industry leader in energy storage and maker of Battle Born Batteries®, announced it has been selected for a second consecutive round of funding through the Nevada Tech Hub.
Designing Without a Rulebook: When Engineering Becomes Innovation
05/05/2026 | Stephen V. Chavez, Siemens EDAWhat if the very rules that made you successful as a PCB designer are the ones now holding you back? This reminds me of walking the floor and attending sessions at both PCB West 2025 and APEX EXPO 2026, where one common theme stood out: More designs with traditional PCB “best practices” simply don’t apply. It’s not because they’re wrong, but because the problems we’re solving have fundamentally changed. In some cases, those best practices can actually limit performance. This is where PCB design moves beyond optimization and into something far more challenging: designing without a rulebook.
Custom LIDAR Optics Support Mission-Critical Performance
05/05/2026 | PRNewswireMeller Optics, Inc. has introduced custom fabricated LIDAR optics that can be engineered for specific UV to IR transmission requirements featured in airborne, ground, and maritime defense systems.
Trouble in Your Tank: In Complex Systems, Design Rules Aren’t Optional
05/06/2026 | Michael Carano -- Column: Trouble in Your TankThere is no question that the electronics industry, especially in circuit board design and fabrication, advanced packaging, and innovation throughout the value chain, has seen a significant transformation, whether it be in materials, system architecture, HDI and ultra HDI, semiconductors, or chiplets. AI and high-performance computing (HPC) are driving change across several fronts, including material properties, assembly techniques (think hybrid bonding), and power management.
EMI Strengthens Test Capability with Acculogic Flying Probe System
05/04/2026 | Express Manufacturing, Inc.Express Manufacturing, Inc. (EMI), a global electronics manufacturing services (EMS) provider, has added the Acculogic Scorpion 980E Flying Probe Test System to its inspection and test operations, giving the company greater flexibility in how it validates and supports today’s increasingly complex electronics.