Amphenol Printed Circuits Shows PCBs for Quantum Computing at 2026 APS

Estimated reading time: 1 minute

Global leader in printed circuit boards (PCBs) and interconnects, Amphenol Printed Circuits (APC), will be attending and exhibiting at the American Physical Society’s APS Global Physics Summit 2026, March 15-20, 2026 in Denver, CO. APC will highlight its extensive capabilities in rigid, flexible and rigid-flex PCBs, with a focus on high-density multilayer flex for quantum.

Amphenol Printed Circuits (www.amphenol-apc.com) invites visitors to Denver to learn more about how quantum computers are making a difference in critical applications and how APC’s advanced circuit materials deliver outstanding performance at millikelvin cryogenic temperatures. With a variety of conductor options, APC works closely with customers to develop practical, repeatable circuit layouts with outstanding signal integrity (SI).

In Denver, APC will show examples of low-layer-count multilayer flexible printed circuits capable of dense signal routing. In quantum applications, these dense circuits and interconnections provide excellent performance and repeatability in the cryogenic environments of quantum computers. APC’s flexible printed circuits are scalable to meet the requirements of the most demanding quantum applications.

Brian Guidi, Senior Applications Engineer and Flex/Rigid-Flex SME at APC, noted: “Quantum development demands a new level of performance, consistency, and scalability from interconnect and PCB technologies. Our experience in high-reliability aerospace, defense, and RF systems positions us well to support the unique requirements of quantum platforms as they evolve from laboratory environments toward scalable architectures.”