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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Rigetti Signs $100M U.S. Government Agreement for Quantum R&D

09/11/2026 | Globe Newswire
Rigetti Computing, Inc., a pioneer in full-stack quantum-classical computing, announced that its wholly owned subsidiary, Rigetti & Co, LLC, has signed a definitive agreement with the U.S. Department of Commerce for an award of $100 million in funding to accelerate superconducting quantum computing R&D.

CAE, WB Electronics Advance Unmanned Systems Training Collaboration

09/09/2026 | PRNewswire
CAE and WB Electronics, a leading company in Poland's defence sector specializing in advanced technologies, announced the signing of a Memorandum of Understanding (MoU) at MSPO 2026.

Follow the Story: AI Reshapes the Electronics Supply Chain

09/09/2026 | Michelle Te, I-Connect007
The AI infrastructure boom is creating enormous opportunities for electronics manufacturers, but its effects are spreading well beyond companies building AI servers and data centers. High performance laminates, glass fabric, copper, memory, MLCCs, foundry capacity, and other critical resources are being pulled toward fast-growing AI applications, tightening supplies and pushing up costs elsewhere in the electronics industry. I-Connect007 has been following these developments from several directions. What initially looked like separate stories about laminate availability, memory prices, component demand, PCB capacity, and data-center growth are demonstrating how AI is changing how the electronics supply chain allocates materials, capacity, and investment.

Flex to Acquire EPC Power

09/09/2026 | Flex
Flex announced that it has entered into a definitive agreement to acquire EPC Power at a value of $4.4 billion, subject to customary adjustments.

Hanwha Aerospace Hosts U.S. Army's Senior Acquisition Leadership at Defense Production Sites

09/08/2026 | Hanwha Aerospace
The Honorable Brent G. Ingraham, Assistant Secretary of the Army for Acquisition, Logistics, and Technology (ASA(ALT)), and his delegation visited Hanwha Aerospace's defense production sites in Changwon, South Korea on August 26 to review the company's manufacturing capabilities across artillery, rocket systems, and other land defense platforms.
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