UHDI, AI, and RF Materials: Signals From the Next Phase of Advanced Packaging

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The upcoming issue of Advanced Electronics Packaging Digest explores several developments shaping the future of advanced electronics, from the convergence of IC substrates and ultra-high-density interconnect (UHDI) PCBs to the growing influence of artificial intelligence on semiconductor packaging and the materials science behind high-frequency system performance.

In a featured conversation, Jan Pedersen of NCAB examines how the lines between IC substrates and UHDI PCBs are rapidly blurring. Drawing on his presentation, “IC Substrates vs. UHDI PCBs,” from the Pan European Design Conference, Pedersen discusses heterogeneous integration, sub-50-micron manufacturing realities, and the global investment pressures driving new approaches to advanced packaging. His perspective highlights why traditional HDI roadmaps may no longer be sufficient as the industry moves toward increasingly complex system architectures.

Another feature highlights insights from the Global Electronics Association’s Executive Pulse webinar series, where Dr. Hemanth Dhavaleswarapu of AMD explores how the rapid rise of artificial intelligence is reshaping semiconductor technology. As AI workloads scale, packaging has become central to enabling continued performance improvements, influencing everything from chip architecture to the design of hyperscale data centers.

Rounding out the issue, Chandra Gupta of Remtec presents the second installment of his series on ceramic substrates for RF, microwave, and millimeter-wave applications. Building on the fundamentals introduced previously, Gupta examines how interconnect design, circuit architecture, and system integration ultimately determine signal performance at high frequencies.

Together, these features provide a multidimensional view of the technological and engineering forces shaping the next generation of electronic systems.

Don’t miss the upcoming issue of Advanced Electronics Packaging Digest for timely insight into the materials, architectures, and industry dynamics shaping advanced packaging today.

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