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March 11, 2026 | HengerEstimated reading time: Less than a minute
Henger is a leading developer of advanced plasma treatment systems for high‑speed, high‑density PCB manufacturing, serving global customers in AI servers, HDI, and advanced packaging. Henger will be exhibiting at APEX EXPO 2026 to present its latest plasma treatment solutions designed for the AI‑driven generation of high‑speed, high‑density PCB manufacturing. As AI servers push PCB designs toward ultra‑high layer counts, advanced materials, and tighter reliability requirements, Henger’s plasma systems provide the precision, uniformity, and process adaptability needed to support next‑generation production.
At this year’s show, Henger will highlight its high‑density plasma technology, optimized for deep‑aspect‑ratio microvias, advanced HDI structures, and emerging materials such as M9‑grade low‑Dk laminates. The company’s systems feature intelligent parameter control, multi‑gas process flexibility, and enhanced energy efficiency — enabling PCB manufacturers to improve adhesion, reduce drilling defects, and achieve higher yields in AI‑era applications.
Henger welcomes visitors to Booth #4647 at APEX EXPO 2026 to learn more about its customized plasma solutions for AI servers, high‑speed digital boards, and advanced packaging substrates.
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