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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Analog Devices to Acquire Alif Semiconductor

09/16/2026 | PRNewswire
Analog Devices, Inc. and Alif Semiconductor announced that they have entered into a definitive agreement under which ADI will acquire Alif in an all-cash transaction for $1.35 billion.

Data Center Power Demand to Rise 31% in 2026, Grid Gap to Widen in 2028

09/16/2026 | TrendForce
TrendForce’s latest AI server industry research reports that CSPs are accelerating infrastructure deployments to meet surging demand for AI applications.

Infineon, SolarEdge Extend 800 VDC AI Data Center Collaboration

09/15/2026 | Infineon
Infineon Technologies AG and SolarEdge Technologies, Inc., a global leader in smart energy, announced an extension of their collaboration to advance solid-state circuit breaker (SSCB) technology for high-voltage DC distribution in AI and hyperscale data centers.

Advanced Packaging at the Limits: What’s Ahead in the Next Issue of Advanced Electronics Packaging Digest

09/15/2026 | I-Connect007
The upcoming issue of Advanced Electronics Packaging Digest looks at what happens as advanced packaging pushes further into the limits of scale, power, thermal performance, and manufacturing capability. These features examine the measurement technologies, materials decisions, manufacturing investments, and system-level challenges shaping the next generation of advanced electronics.

Dr. Jennie Hwang to Deliver Two PDCs at SMTA International 2026

09/14/2026 | Dr. Jennie Hwang
Dr. Jennie Hwang to deliver two PDCs on “AI-Powered Manufacturing: From Fundamentals to Factory Impact” (PDC5) and “Mastering Intermetallics for Reliable Electronics” (PDC2) at the 2026 SMTA International Conference.
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