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Suggested Items

AT&S Advances Glass Core Substrates for AI, HPC, and Photonics

04/22/2026 | AT&S
AT&S is advancing glass core substrates from research toward industrial use in artificial intelligence, high-performance computing, high-speed communications and photonics.

Intel, Dell Technologies and Nokia Redefine UPF Deployment at the Far Edge

04/21/2026 | Intel
Dell PowerEdge XR8000 with Intel® Xeon™ 6 SoC delivers high-performance UPF compute to rugged, space‑ and power‑constrained 5G edge environments.

Introducing FKN Systek Depanelizer with Linear Guide Table for Small PCBs

04/20/2026 | FKN Systek
Singulating small PCBs with circular blade depanelizers can be a tedious repetitive process which can easily result in board damage due to operator fatigue. Increase process quality and safety by using the FKN Systek K2010 motorized circular blade depanelizer with a support table to separate the V-Scored boards.

Henger Targets AI PCB Challenges With Advanced Plasma Technology

04/02/2026 | I-Connect007 Editorial Team
Henger is pushing the boundaries of PCB manufacturing with its dynamic, next-generation plasma technology, purpose-built for the demands of AI-driven electronics. As designs move toward higher density, faster speeds, and advanced materials like M9 laminates, Henger’s innovative plasma systems deliver precise, uniform, and energy-efficient processing. In this interview, company leaders, Zhiquang Li and Ping Tang discuss how their cutting-edge solutions are redefining cleaning, surface activation, and process control—positioning plasma technology as a critical enabler of reliability and performance in the rapidly evolving AI hardware landscape.

Foxconn Reports Record FY2025 Revenue, Strong AI Growth, and Historic Dividend

03/16/2026 | Foxconn
Hon Hai Technology Group (Foxconn) announced its full year and fourth quarter 2025 financial results. Full-year net profit (attributable to the parent company) totaled NT$189.3 billion and EPS of NT$13.61 reached a record high since its listing in 1991.
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