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Henger Targets AI PCB Challenges With Advanced Plasma Technology

04/02/2026 | I-Connect007 Editorial Team
Henger is pushing the boundaries of PCB manufacturing with its dynamic, next-generation plasma technology, purpose-built for the demands of AI-driven electronics. As designs move toward higher density, faster speeds, and advanced materials like M9 laminates, Henger’s innovative plasma systems deliver precise, uniform, and energy-efficient processing. In this interview, company leaders, Zhiquang Li and Ping Tang discuss how their cutting-edge solutions are redefining cleaning, surface activation, and process control—positioning plasma technology as a critical enabler of reliability and performance in the rapidly evolving AI hardware landscape.

Foxconn Reports Record FY2025 Revenue, Strong AI Growth, and Historic Dividend

03/16/2026 | Foxconn
Hon Hai Technology Group (Foxconn) announced its full year and fourth quarter 2025 financial results. Full-year net profit (attributable to the parent company) totaled NT$189.3 billion and EPS of NT$13.61 reached a record high since its listing in 1991.

East Asia at APEX EXPO 2026: Focusing on Cross-regional Exchange and Industry Connectivity

03/03/2026 | Sydney Xiao, Global Electronics Association East Asia
At APEX EXPO 2026, the Global Electronics Association East Asia team will promote engagement with global experts, industry partners, and member companies by participating in technical committee meetings and industry forums, and by organizing networking dinners and exhibitor visits. More than 40 companies from East Asia are expected to exhibit at this year’s show, representing Mainland China, Taiwan Region, Japan, and Korea.

Your 2026 Business Playbook: Step 5: Actions and Measurements—The 2026 Scoreboard That Drives Behavior

12/16/2025 | Dan Beaulieu, D.B. Management Group
As we head into 2026—a year that will demand discipline, focus, customer obsession, and speed—you need a scoreboard that drives performance across your entire organization. You need a handful of critical, high-impact metrics that guide your actions every single week, so, let’s talk about the scoreboard that will make 2026 a breakout year.

PCBAIR Unveils 8-Layer Glass Core PCB Manufacturing for Next-Gen AI & HPC

12/08/2025 | PRNewswire
PCBAIR announced the launch of its advanced 8-layer Glass Core PCB manufacturing capabilities, combining proprietary Through Glass Via (TGV) technology with multi-layer redistribution layers (RDL).
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