Jabil Posts Strong Q2 Results
March 19, 2026 | JabilEstimated reading time: Less than a minute
Jabil Inc., reported preliminary, unaudited financial results for its second quarter of fiscal year 2026.
Second Quarter of Fiscal Year 2026 Highlights:
- Net revenue: $8.3 billion
- U.S. GAAP operating income: $374 million
- U.S. GAAP diluted earnings per share: $2.08
- Core operating income (Non-GAAP): $436 million
- Core diluted earnings per share (Non-GAAP): $2.69
“Jabil delivered a very strong second quarter, with results ahead of our expectations across revenue, core operating margin, and core EPS,” said CEO Mike Dastoor. “Our better-than-expected performance in the quarter was broad-based, reflecting the strength of our diversified portfolio and was led by continued momentum in Intelligent Infrastructure, where demand remains robust across cloud and data center infrastructure, networking and communications, and capital equipment. We also saw encouraging improvement in Regulated Industries, with automotive and renewables performing better than we anticipated earlier in the year.”
“Given the strength of our second-quarter results and increasing confidence in the back half of the year, we are raising our fiscal 2026 outlook for revenue and core EPS. As we move ahead, we remain focused on profitable growth, disciplined execution, margin expansion, strong cash generation, and delivering long-term value for our shareholders,” he added.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Henger Targets AI PCB Challenges With Advanced Plasma Technology
04/02/2026 | I-Connect007 Editorial TeamHenger is pushing the boundaries of PCB manufacturing with its dynamic, next-generation plasma technology, purpose-built for the demands of AI-driven electronics. As designs move toward higher density, faster speeds, and advanced materials like M9 laminates, Henger’s innovative plasma systems deliver precise, uniform, and energy-efficient processing. In this interview, company leaders, Zhiquang Li and Ping Tang discuss how their cutting-edge solutions are redefining cleaning, surface activation, and process control—positioning plasma technology as a critical enabler of reliability and performance in the rapidly evolving AI hardware landscape.
Foxconn Reports Record FY2025 Revenue, Strong AI Growth, and Historic Dividend
03/16/2026 | FoxconnHon Hai Technology Group (Foxconn) announced its full year and fourth quarter 2025 financial results. Full-year net profit (attributable to the parent company) totaled NT$189.3 billion and EPS of NT$13.61 reached a record high since its listing in 1991.
East Asia at APEX EXPO 2026: Focusing on Cross-regional Exchange and Industry Connectivity
03/03/2026 | Sydney Xiao, Global Electronics Association East AsiaAt APEX EXPO 2026, the Global Electronics Association East Asia team will promote engagement with global experts, industry partners, and member companies by participating in technical committee meetings and industry forums, and by organizing networking dinners and exhibitor visits. More than 40 companies from East Asia are expected to exhibit at this year’s show, representing Mainland China, Taiwan Region, Japan, and Korea.
Your 2026 Business Playbook: Step 5: Actions and Measurements—The 2026 Scoreboard That Drives Behavior
12/16/2025 | Dan Beaulieu, D.B. Management GroupAs we head into 2026—a year that will demand discipline, focus, customer obsession, and speed—you need a scoreboard that drives performance across your entire organization. You need a handful of critical, high-impact metrics that guide your actions every single week, so, let’s talk about the scoreboard that will make 2026 a breakout year.
PCBAIR Unveils 8-Layer Glass Core PCB Manufacturing for Next-Gen AI & HPC
12/08/2025 | PRNewswirePCBAIR announced the launch of its advanced 8-layer Glass Core PCB manufacturing capabilities, combining proprietary Through Glass Via (TGV) technology with multi-layer redistribution layers (RDL).