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Celestica Inc., a global leader in data center infrastructure and advanced technology solutions, and AMD, a leader in high-performance and AI computing, announced a strategic collaboration to bring the new “Helios” rack-scale AI platform to market. The collaboration pairs AMD computing leadership with Celestica’s expertise in delivering leading-edge networking switch technologies.
At launch, Celestica will undertake the R&D, design and manufacturing of scale-up networking switches in the AMD “Helios” rack-scale AI architecture, based on the Open Compute Project (OCP), Open-Rack-Wide (ORW) form-factor.
The scale-up switches will utilize advanced networking silicon to enable the high-speed interconnect of the next-generation AMD Instinct™ MI450 Series GPUs, enabling leading-edge computing, optimized for large-scale AI clusters. Consistent with the open standards-based design of the “Helios” platform, the networking switches will utilize the Ultra Accelerator Link over Ethernet (UALoE) architecture for scale-up connectivity. AMD “Helios” will be available to customers in late 2026.
“Deploying AI at scale requires infrastructure that can be delivered quickly, consistently, and with the performance customers expect,” said Steven Dorwart, senior vice president and general manager, Hyperscalers, Celestica. “Our collaboration with AMD on the “Helios” platform brings together our global engineering, manufacturing, and supply chain capabilities with AMD’s innovation in high-performance computing. Together, we are accelerating access to AI systems optimized for the most demanding workloads of the next era.”
“‘Helios’ represents a new blueprint for AI infrastructure, enabling customers to deploy AI at scale with the performance, efficiency, and flexibility required for the next generation of workloads,” said Forrest Norrod, executive vice president and general manager, Data Center Solutions Business Group, AMD. “We are pleased to work with Celestica, leveraging their expertise in delivering leading-edge networking switch technology with AMD’s leadership in high-performance and AI computing.”
The companies are collaborating to support deployments of “Helios” across cloud, enterprise, and research environments, helping to address a growing need for solutions that reduce time-to-value and improve supply chain resiliency for organizations investing in AI.
