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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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Synopsys Showcases Autonomous Engineering with NVIDIA

07/28/2026 | PRNewswire
At the 2026 DAC Chips to Systems Conference, Synopsys, Inc. announced advancements to agentic AI for engineering in collaboration with NVIDIA.

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Revenue of $1.584 billion, compared to revenue of $1.275 billion in Q2 2025.

Siemens Advances Self-verifying Agentic AI Workflows for Semiconductor and PCB Design

07/27/2026 | Siemens Digital Industries
Siemens announced an expansion of its strategic partnership with NVIDIA to deliver self-verifying agentic AI workflows to EDA, helping semiconductor and printed circuit board (PCB) engineering teams move from autonomous task orchestration toward more trusted, continuously validated engineering outcomes.

Mixx Technologies Acquires Sophic Silicon Technologies and Announces Manufacturing Collaboration with Kaynes Semicon

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Mixx Technologies, Inc., a US based venture-backed deep-tech company building the interconnect layer for hyperscale AI infrastructure, today announced two simultaneous strategic moves that together mark a defining moment in India's semiconductor journey.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

07/23/2026 | Marcy LaRont, I-Connect007
In this week’s top five must-reads, I chose articles that go from big business questions (to diversify or not), to important technical issues such as DFM errors made in creating HDI designs using ELIC and design for test, to a discussion around some of the power and thermal considerations in advanced packaging, and the fact that they are now, firmly, performance enablers, not after-the-fact elements to be managed in fabrication.
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