Share on:

Share on LinkedIn Share on X Share on Facebook Share with email


Advanced Electronics Packaging Digest

Subscribe

Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

Subscribe now to stay informed, competitive, and connected.

Suggested Items

Intervala Names George Yeary Vice President of Quality and Customer Experience

06/10/2026 | BUSINESS WIRE
Intervala, a full-service electronics manufacturing services (EMS) provider specializing in complex electronic and electromechanical products, announced key additions and promotions within its leadership team as the company continues to expand its capabilities across industrial technology, data center infrastructure, aerospace and defense, and medical device markets.

Plexus Releases Fiscal 2025 Sustainability Report, Shifts to Absolute Emission Targets

06/10/2026 | Plexus
Plexus Corp. announced the release of its Fiscal 2025 Sustainability Report. The report, which is now available on the Sustainability page of plexus.com, marks a significant evolution from intensity-based metrics to measurable, absolute emissions reduction goals.

NOTE's Kasdon Electronics Expands UK Footprint with New Investment in Wolverhampton

06/10/2026 | NOTE
Kasdon Electronics, a NOTE company, invests in Wolverhampton and strengthens its UK operations.

Incap Updates its Leadership Model to Support its Growth Strategy

06/10/2026 | Incap
Incap Corporation is restructuring its management organisation by introducing a geographically organised leadership model.

W&S Enters New Growth Phase Through Strategic Partnership and New Leadership

06/09/2026 | W&S
W&S, an established distributor and service partner of capital equipment, automation solutions and lifecycle services for the electronics manufacturing industry in the Benelux, has announced a new strategic partnership and strengthened shareholder structure to support the next phase of its growth.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in