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Rewiring Medical Brain-Machine Communication With Flex PCBs

07/09/2026 | Anaya Vardya, American Standard Circuits
Flex and rigid-flex PCBs are shaping the future through a range of innovative applications, including neural interface arrays that redefine brain-machine communication in the medical field. For decades, scientists and engineers have dreamed of tapping into this electrochemical symphony, and flex PCBs are finally making that dream clinically viable.

IEEE Study Shows Thermal Scaling Analysis of Large Hybrid Laser Arrays for Co-Packaged Optics

07/22/2025 | PRNewswire
Multi-wavelength light sources are required for optical transceivers to increase data. However, scaling the laser array size increases thermal crosstalk, which may affect laser efficiency and reliability.

BEST Inc. Reports Record Demand for EZReball BGA Reballing Process

05/01/2025 | BEST Inc.
BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.

NASA Tests Ultralight Antennas to Benefit Future National Airspace

04/28/2025 | NASA
NASA engineers are using one of the world’s lightest solid materials to construct an antenna that could be embedded into the skin of an aircraft, creating a more aerodynamic and reliable communication solution for drones and other future air transportation options. 

Rocket Lab Expands Satellite Solutions with Customizable Solar Arrays

04/10/2025 | BUSINESS WIRE
Rocket Lab USA, Inc., a global leader in launch services and space systems, today introduced the Company’s family of customizable, next-generation solar arrays, Standardized Array (STARRAY), to meet the diverse power needs of satellites operating in any orbital conditions.
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