Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Testimonial

"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"

Rachael Temple - Alltemated

Suggested Items

Semiconductor Packaging Materials Market to Hit $93.7B by 2031, Driven by AI and Chiplet Demand

05/22/2026 | openPR
The global Semiconductor and IC Packaging Materials Market reached USD 43.1 billion in 2023 and is expected to reach USD 93.7 billion by 2031, growing at a CAGR of 10.2% during the forecast period of 2024-2031.

Amphenol Printed Circuits Shows PCBs of All Sizes at 2026 IEEE MTT-S

05/22/2026 | Amphenol Printed Circuits
Amphenol Printed Circuits (APC) will once again be bringing examples of their printed circuit board (PCB) design and manufacturing skills to the RF/microwave industry’s major annual technology event, 2026 IEEE MTT-S International Microwave Symposium (IMS), June 9–11, at the Thomas M. Menino Convention & Exhibition Center in Boston.

New Senate Bill Supports Reshoring and Restoring U.S. Printed Circuit Board Manufacturing

05/21/2026 | PCBAA
The Printed Circuit Board Association of America celebrates the introduction of a crucial bill that will pave the way to reshore and restore America’s printed circuit board (PCB) industry. Over the past 30 years U.S. share of the world supply of PCBs shrunk from 30 percent to 4 percent because of offshoring. Congress is offering legislative solutions to reverse this trend.

Asahi Kasei Develops Photosensitive Polyimide Film for Panel-Level Semiconductor Packaging

05/21/2026 | BUSINESS WIRE
Panel-level packaging has gained momentum in the semiconductor industry as manufacturers pursue higher efficiency and improved yield that can support next-generation packaging processes. In response to these market changes, Asahi Kasei, a diversified global company, has combined the features of its photosensitive polyimide (PSPI) and dry film photoresist (DFR) into a new photosensitive film.

IBM, U.S. Department of Commerce Announce America's First Quantum Foundry with $1B CHIPS Award

05/21/2026 | PRNewswire
IBM and the U.S. Department of Commerce (DoC) announced a Letter of Intent (LOI) to build an American quantum chip foundry, securing the nation's global quantum leadership and fueling the country's growing quantum ecosystem.
Copyright © I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in