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Advanced Electronics Packaging Digest

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Extropic Signs $75M LOI with U.S. Commerce Department

08/03/2026 | PRNewswire
Extropic, the American company pioneering thermodynamic computing hardware, announced the signing of a letter of intent with the U.S. Department of Commerce for up to $75 million in funding through the CHIPS Research and Development Office (CRDO).

HRL Demonstrates a Silicon Quantum Processor That Runs Itself

07/31/2026 | BUSINESS WIRE
HRL Laboratories published a quantum computing milestone in Nature today: a quantum processor that runs itself.

Qnity Strengthens Long-Term Innovation and Advanced Packaging Roadmap

07/29/2026 | BUSINESS WIRE
Qnity Electronics, Inc., a premier technology solutions leader across the semiconductor value chain, announced it is accelerating investments in next-generation technologies through access to a broad portfolio of research programs.

Intel, Lens Technology Collaborate to Enable Advanced Semiconductor Packaging for the AI Era

07/27/2026 | Intel
Intel Corporation and Lens Technology announced a strategic collaboration focused on enabling new technologies for advanced semiconductor packaging.

IBM to Acquire HRL Laboratories to Power the Future of Quantum

07/23/2026 | IBM
IBM today announced it has signed a definitive agreement to acquire HRL Laboratories, LLC (HRL), a flagship research and development institution. HRL is a private company jointly owned by Boeing and General Motors. Both Boeing and GM will continue to partner with IBM on quantum applications and advanced technology development following the transaction.
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