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Advanced Electronics Packaging Digest

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Scale-Up: From Monolithic Silicon to Advanced Packaging

10/15/2026 | Chetan Arvind Patil, Marvell Technology
This is the first in a three-part series exploring scale-up, scale-out, and scale-across in advanced packaging. Scale-up focuses on increasing compute capability, memory capacity, and communication bandwidth within tightly integrated computing systems. Scale-out expands computing capacity by connecting multiple servers, compute nodes, and racks through high-speed networks. Scale-across focuses on integrating and coordinating diverse computing resources, technologies, and workloads across data centers to improve overall efficiency and resource utilization.

Foxconn Research Institute’s Two Quantum Studies Accepted by FOCS 2026

10/13/2026 | Foxconn
Demonstrating its strong forward-looking R&D capabilities, two fundamental theoretical studies from the Hon Hai Research Institute, under Hon Hai Technology Group (Foxconn), have been accepted by the IEEE Symposium on Foundations of Computer Science (FOCS 2026), universally recognized as the highest distinction in theoretical computer science.

Infineon, ZuriQ Deepen Quantum Chip Partnership

10/08/2026 | Infineon
Infineon Technologies AG and ZuriQ AG, a Swiss quantum computing company spun out of ETH Zurich, today announced the expansion of their collaboration to advance scalable quantum computing hardware.

Xanadu, GlobalFoundries Partner on Quantum Manufacturing

10/07/2026 | GlobalFoundries
Xanadu Quantum Technologies Limited, a leading photonic quantum computing company, announced a strategic multi-year partnership with GlobalFoundries (GF), a leading semiconductor manufacturer, to address the high-volume production required for utility-scale quantum computing.

Pasqal Leads Q-PLANET to Advance EU Neutral-Atom Quantum Technologies

10/06/2026 | Globe Newswire
Pasqal, a global leader in neutral-atom quantum computing, is coordinating the implementation of Q-PLANET (Quantum Pilot Line for production of Advanced chips for Neutral atom European Technologies), co-funded by the EU Chips Joint Undertaking (Chips JU) and National/Regional authorities.
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