-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current Issue
Spotlight on North America
A North America spotlight exploring tariffs, reshoring, AI demand, and supply chain challenges. Plus, insights on cybersecurity, workforce development, and the evolving role of U.S. electronics manufacturing.
Wire Harness Solutions
Explore what’s shaping wire harness manufacturing, and how new solutions are helping companies streamline operations and better support EMS providers. Take a closer look at what’s driving the shift.
Spotlight on Europe
As Europe’s defense priorities grow and supply chains are reassessed, industry and policymakers are pushing to rebuild regional capability. This issue explores how Europe is reshaping its electronics ecosystem for a more resilient future.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
IISc, CADFEM & Synopsys Launch Advanced Simulation Center at CeNSE
March 26, 2026 | PRNewswireEstimated reading time: 3 minutes
Ultra-high-speed electronic systems are increasingly shaping the technological frontier across sectors such as aerospace and defence, advanced healthcare, robotics, autonomous mobility, and high-performance computing. At the core of these systems lie semiconductor technologies—the integrated circuits and chips that enable modern computation, sensing, communication, and control. As nations accelerate their pursuit of advanced digital capabilities, semiconductor innovation has also emerged as a critical pillar of technological capability and long-term strategic sovereignty.
In resonance with and reflection of these technological advances and their strategic imperatives, the Indian Institute of Science has entered into a strategic tripartite Memorandum of Understanding with CADFEM India Pvt. Ltd. and Synopsys to establish an advanced Center of Excellence (CoE) for Simulation and Digital Engineering at the Centre for Nano Science and Engineering (CeNSE).
The collaboration will bring together high-fidelity simulation, electronic design automation (EDA), and digital engineering workflows within CeNSE to accelerate semiconductor and electronic system development in India. As a cornerstone of Industry 4.0, semiconductor innovation is closely linked with the rapid rise of AI—each driving advancements in the other. However, while AI evolves at high speed, semiconductor development remains a complex, multi-year process. Bridging this gap, physics-based multiphysics simulation enables engineers to predict device behavior, optimize designs, and significantly accelerate the journey from concept to silicon.
The Center of Excellence will bring together state-of-the-art multiphysics simulation tools, computational infrastructure, and specialized training programs to support research across key technology domains including photonics, optics, electronics, MEMS, and NEMS, particularly within the context of quantum technologies and next-generation semiconductor systems.
"Integrating advanced simulation capabilities into our research ecosystem will enable our teams to evaluate complex device behavior much earlier in the design cycle. In domains such as photonics, semiconductor devices, and nanoscale systems, the ability to digitally validate concepts prior to fabrication will significantly accelerate research progress while strengthening design confidence and technical rigor" said Dr. Shankar Kumar Selvaraja, Associate Professor and Associate Chair at CeNSE, IISc.
Under the collaboration, CADFEM India, along with Synopsys will support the deployment of simulation software and hardware infrastructure, while also providing technical support, training programs, and access to online learning resources and certification platforms. These initiatives will help build strong simulation expertise within the research community while enabling broader adoption of digital engineering approaches.
"Simulation today is no longer merely a design tool; it has become a strategic enabler of innovation. When high-fidelity multiphysics simulation is embedded within research environments such as CeNSE, it establishes a powerful digital engineering capability that enables scientists and engineers to explore a broader design space, validate ideas at much earlier stages, and significantly accelerate the pace of technology development," said Dr.-Ing Madhukar Chatiri, CEO of CADFEM APAC.
Murali Pullela, Country Head (S&A), Synopsys said, "Semiconductor innovation is today at the intersection of advanced design, simulation, and system-level thinking. Synopsys' collaboration with the IISc and CADFEM is a reflection of our commitment to strengthen India's deep-tech ecosystem by allowing access to world-class electronic design automation and simulation capabilities. We believe that this will empower researchers to move from concept to validated design much faster and also help in building critical capabilities in areas such as nanoscale devices, photonics and next-generation electronic systems. This CoE launch is a key step toward developing India's future semiconductor ambitions."
The collaboration will also emphasize capability development through thematic workshops, joint training programs, and structured learning initiatives designed to strengthen simulation expertise across CeNSE's research community and create stronger linkages between academic discovery and engineering practice.
As Dr. Chatiri further noted, "Our goal is to help build a connected digital engineering ecosystem in which academia and industry collaborate more closely. By combining IISc's research excellence with Synopsys' multiphysics technologies and CADFEM's implementation expertise, we aim to create an environment where innovation can move from concept to validated design far more efficiently and with greater technical confidence."
CADFEM India and Synopsys partners with IISc to accelerate innovation through simulation technologies.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
SEMI Appoints Julie Rogers Executive Director of the ESD Alliance
05/01/2026 | SEMISEMI, the industry association serving the global semiconductor and electronics design and manufacturing supply chain, announced the appointment of Julie Rogers as Executive Director of the Electronic System Design Alliance (ESDA), a SEMI Technology Community.
SEMI ESD Alliance 2026 Outlook: Agentic AI to Transform Chip Design and Verification
05/01/2026 | SEMIThe Electronic System Design Alliance (ESD Alliance), a SEMI Technology Community, announced its annual Executive Outlook event for semiconductor EDA, agentic AI and IP company executives.
Teradyne Reports New Record High in Q1 2026
04/30/2026 | BUSINESS WIRETeradyne, Inc. reported revenue of $1,282 million for the first quarter of 2026 of which $1,111 million was in Semiconductor Test, $91 million in Robotics, and $80 million in Product Test. GAAP net income for the first quarter of 2026 was $398.9 million, or $2.53 per diluted share.
SEMI Reports 13% Year-on-Year Growth in Global Silicon Wafer Shipments in Q1 2026
04/30/2026 | SEMIThe SEMI Silicon Manufacturers Group (SMG) reported, in its quarterly analysis of the silicon wafer industry, that worldwide silicon wafer shipments increased 13.1% year-on-year to 3,275 million square inches (MSI) from the 2,896 MSI recorded during the same quarter of 2025.
SCHMID Launches 'Any Layer ET' for Panel-Level Advances Packaging, to Present at ECTC 2026
04/30/2026 | SCHMID GroupSCHMID Group, a global leader in advanced manufacturing solutions for the electronics and semiconductor industries, is advancing next-generation substrate manufacturing with its proprietary Any Layer ET (Embedded Trace) Process for full panel-level Advanced Packaging.